Inventor · disambiguated record
Toshihiro Iwasaki
Also filed as: IWASAKI TOSHIHIRO
24 granted patents·4 pending applications·216 citations·filing 1999–2017
95Inventor score
Files withRENESAS ELECTRONICS CORP9J-DEVICES CORP7MITSUBISHI ELECTRIC CORP5RENESAS TECH CORP5BABA SHINJI1
Top patents by PatentIndex Score
28 records- 0192US8729709B2Semiconductor deviceBABA SHINJI·Filed 2011·Granted May 20, 2014·12 cites·14 claims
- 0289US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0388US6677677B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jan 13, 2004·59 cites·12 claims
- 0486US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 0585US9837382B2Semiconductor package and manufacturing method thereofJ-DEVICES CORP·Filed 2016·Granted Dec 5, 2017·5 cites·10 claims
- 0685US7951699B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2006·Granted May 31, 2011·16 cites·4 claims
- 0784US7443036B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Oct 28, 2008·11 cites·10 claims
- 0880US9553052B2Magnetic shielding package of non-volatile magnetic memory elementJ-DEVICES CORP·Filed 2015·Granted Jan 24, 2017·4 cites·4 claims
- 0978US9171791B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 27, 2015·3 cites·10 claims
- 1077US6777814B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Aug 17, 2004·28 cites·9 claims
- 1176US10256196B2Semiconductor device and method for manufacturing sameJ DEVICES CORP·Filed 2016·Granted Apr 9, 2019·3 cites·5 claims
- 1268US9818679B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 14, 2017·1 cites·16 claims
- 1368US6462425B1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 8, 2002·36 cites·14 claims
- 1464US9171814B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 27, 2015·1 cites·8 claims
- 1563US7745258B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Jun 29, 2010·2 cites·4 claims
- 1662US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 1758US10134663B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 20, 2018·0 cites·9 claims
- 1857US6756686B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Jun 29, 2004·8 cites·17 claims
- 1954US6509206B2Method and apparatus for manufacturing semiconductor device, and semiconductor device manufactured by the methodMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jan 21, 2003·5 cites·14 claims
- 2054US6404059B1Semiconductor device having a mounting structure and fabrication method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jun 11, 2002·7 cites·20 claims
- 2152US8994175B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 31, 2015·0 cites·16 claims
- 2248US9837369B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 5, 2017·0 cites·12 claims
- 2346US9922931B2Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structureJ DEVICES CORP·Filed 2017·Granted Mar 20, 2018·0 cites·5 claims
- 2446US2018047695A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 2545US10037966B2Semiconductor device and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 31, 2018·0 cites·6 claims
- 2641US2012098126A1Semiconductor device and manufacturing method thereforIWASAKI TOSHIHIRO·Filed 2011·Application pending·0 cites
- 2738US2005046036A1Semiconductor device, semiconductor module and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 2835US2003057569A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →