Inventor · disambiguated record
Tomonori Kawasaki
Also filed as: KAWASAKI TOMONORI
15 granted patents·2 pending applications·38 citations·filing 1976–2023
89Inventor score
Top patents by PatentIndex Score
17 records- 0184US9630292B2Single side polishing apparatus for waferSUMCO CORP·Filed 2016·Granted Apr 25, 2017·2 cites·8 claims
- 0283US7540800B2Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor waferSUMCO TECHXIV CORP·Filed 2007·Granted Jun 2, 2009·10 cites·3 claims
- 0377US11097397B2Polishing device, polishing method, and record mediumTOSHIBA MEMORY CORP·Filed 2018·Granted Aug 24, 2021·1 cites·12 claims
- 0474US8664092B2Method for cleaning silicon wafer, and method for producing epitaxial wafer using the cleaning methodKAWASAKI TOMONORI·Filed 2010·Granted Mar 4, 2014·4 cites·4 claims
- 0573US9266213B2Method of polishing one side of wafer and single side polishing apparatus for waferSUMCO CORP·Filed 2013·Granted Feb 23, 2016·2 cites·8 claims
- 0672US9305850B2Etching method and etching apparatus of semiconductor waferKOZASA KAZUAKI·Filed 2012·Granted Apr 5, 2016·3 cites·7 claims
- 0769US8334222B2Semiconductor wafer processing method and apparatusGOTOU ISAMU·Filed 2009·Granted Dec 18, 2012·5 cites·6 claims
- 0869US2024181595A1Polishing head, polishing apparatus, and elastic bodyKIOXIA CORP·Filed 2023·Application pending·0 cites
- 0964US10391607B2Single-wafer processing method of polishing one side of semiconductor wafer and single-wafer processing apparatus for polishing one side of semiconductor waferSUMCO CORP·Filed 2015·Granted Aug 27, 2019·1 cites·4 claims
- 1062US8273260B2Etching method and etching apparatus of semiconductor waferKOZASA KAZUAKI·Filed 2009·Granted Sep 25, 2012·2 cites·9 claims
- 1157US11583975B2Dresser, polishing device, and method of dressing polishing padKIOXIA CORP·Filed 2019·Granted Feb 21, 2023·0 cites·7 claims
- 1255US10744616B2Wafer polishing method and apparatusSUMCO CORP·Filed 2016·Granted Aug 18, 2020·0 cites·10 claims
- 1351US7666063B2Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor waferSUMCO TECHXIV CORP·Filed 2008·Granted Feb 23, 2010·0 cites·3 claims
- 1451US2023062333A1Semiconductor device and substrateKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1549US9919402B2Method of polishing wafer and wafer polishing apparatusSUMCO CORP·Filed 2014·Granted Mar 20, 2018·0 cites·8 claims
- 1647US4106087APower-supply device for working machine such as a spark-erosion machineKAWASAKI TOMONORI·Filed 1976·Granted Aug 8, 1978·8 cites·5 claims
- 1744US8992791B2Method of cleaning semiconductor wafer and semiconductor waferKOZASA KAZUAKI·Filed 2009·Granted Mar 31, 2015·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →