Inventor · disambiguated record
Toshiyuki Majima
Also filed as: MAJIMA TOSHIYUKI
10 granted patents·12 pending applications·41 citations·filing 2003–2013
86Inventor score
Top patents by PatentIndex Score
22 records- 0181US7458505B2Boring deviceDAIDO KOGYO KK·Filed 2003·Granted Dec 2, 2008·17 cites·5 claims
- 0277US7469622B2Paper cutting machine having movable restDAIDO KOGYO KK·Filed 2005·Granted Dec 30, 2008·4 cites·4 claims
- 0374US8146472B2Paper cutting device having receiving partNISHIMURA KAZUO·Filed 2006·Granted Apr 3, 2012·5 cites·14 claims
- 0473US7865012B2Semiconductor failure analysis apparatus which acquires a failure observed image, failure analysis method, and failure analysis programHAMAMATSU PHOTONICS KK·Filed 2006·Granted Jan 4, 2011·4 cites·18 claims
- 0572US7901958B2Fabrication method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 8, 2011·2 cites·18 claims
- 0670US7522355B2Lens unit and manufacturing method thereofKONICA MINOLTA OPTO INC·Filed 2005·Granted Apr 21, 2009·2 cites·17 claims
- 0769US7805691B2Semiconductor failure analysis apparatus, failure analysis method, and failure analysis programHAMAMATSU PHOTONICS KK·Filed 2006·Granted Sep 28, 2010·6 cites·20 claims
- 0865US9625710B2Optical element, an optical scanning device, a manufacturing method of the optical element, and a molding dieKONICA MINOLTA INC·Filed 2013·Granted Apr 18, 2017·1 cites·6 claims
- 0952US2008020498A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2007·Application pending·0 cites
- 1050US2011175634A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2011·Application pending·0 cites
- 1150US2011136272A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2011·Application pending·0 cites
- 1243US2010275754A1Punching unitDAIDO KOGYO KK·Filed 2008·Application pending·0 cites
- 1343US2006081106A1Vibration-type paper cutting deviceNISHIMURA KAZUO·Filed 2004·Application pending·0 cites
- 1442US2005093565A1Fabrication method of semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 1542US2007020781A1Semiconductor failure analysis apparatus, failure analysis method, and failure analysis programHAMAMATSU PHOTONICS KK·Filed 2006·Application pending·0 cites
- 1640US2011138980A1Punching unitDAIDO KOGYO KK·Filed 2010·Application pending·0 cites
- 1739US9372321B2Optical element, holding structure therefor, and optical deviceHARA SHINICHIRO·Filed 2012·Granted Jun 21, 2016·0 cites·20 claims
- 1837US2011197725A1Punching unitDAIDO KOGYO KK·Filed 2011·Application pending·0 cites
- 1937US2007290696A1Semiconductor failure analysis apparatus, failure analysis method, and failure analysis programHAMAMATSU PHOTONICS KK·Filed 2006·Application pending·0 cites
- 2034US8578829B2Punching unitMAJIMA TOSHIYUKI·Filed 2010·Granted Nov 12, 2013·0 cites·4 claims
- 2133US2012008183A1Resin molded article for optical element, method for manufacturing resin molded article for optical element, device for manufacturing resin molded article for optical element, and scanning optical deviceHARA SHINICHIRO·Filed 2010·Application pending·0 cites
- 2233US2012261845A1Resin Molded Article For Optical Element Manufacturing Apparatus And Method Of The SameHARA SHINICHIRO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →