Inventor · disambiguated record
Tomohiro Uno
Also filed as: UNO TOMOHIRO
86 granted patents·24 pending applications·368 citations·filing 1991–2024
99Inventor score
Files withNIPPON MICROMETAL CORP35NIPPON STEEL CHEMICAL & MAT CO LTD14UNO TOMOHIRO11NIPPON STEEL CORP8SEIKO EPSON CORP8
Top patents by PatentIndex Score
110 records- 0197US8653668B2Copper bonding wire for semiconductor device and bonding structure thereofUNO TOMOHIRO·Filed 2011·Granted Feb 18, 2014·51 cites·14 claims
- 0296US8836147B2Bonding structure of multilayer copper bonding wireUNO TOMOHIRO·Filed 2011·Granted Sep 16, 2014·44 cites·29 claims
- 0395US10615123B2Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Apr 7, 2020·11 cites·10 claims
- 0494US7820913B2Bonding wire for semiconductor deviceNIPPON STEEL MATERIALS CO LTD·Filed 2006·Granted Oct 26, 2010·34 cites·16 claims
- 0592US10121965B1Resistive random access memory device containing discrete memory material portions and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Nov 6, 2018·18 cites·20 claims
- 0692US7952028B2Bonding wire for semiconductor deviceNIPPON STEEL MATERIALS CO LTD·Filed 2009·Granted May 31, 2011·25 cites·11 claims
- 0791US8389860B2Bonding wire for semiconductor devicesUNO TOMOHIRO·Filed 2008·Granted Mar 5, 2013·21 cites·13 claims
- 0890US10323294B2Austenitic stainless steel foilNIPPON STEEL & SUMIKIN MAT CO·Filed 2016·Granted Jun 18, 2019·2 cites·11 claims
- 0989US10137534B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 27, 2018·5 cites·8 claims
- 1089US9887172B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Feb 6, 2018·6 cites·9 claims
- 1189US9773748B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Sep 26, 2017·5 cites·7 claims
- 1287US11612966B2Ag alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2020·Granted Mar 28, 2023·2 cites·8 claims
- 1386US12090578B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Sep 17, 2024·2 cites·2 claims
- 1486US11217532B2Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Jan 4, 2022·4 cites·18 claims
- 1586US10381320B2Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmiumNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Aug 13, 2019·6 cites·18 claims
- 1686US8004094B2Copper alloy bonding wire for semiconductor deviceNIPPON STEEL MATERIALS CO LTD·Filed 2010·Granted Aug 23, 2011·7 cites·24 claims
- 1785US10610976B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Apr 7, 2020·1 cites·22 claims
- 1885US8742258B2Bonding wire for semiconductorTERASHIMA SHINICHI·Filed 2010·Granted Jun 3, 2014·9 cites·15 claims
- 1984US11373934B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Jun 28, 2022·4 cites·13 claims
- 2077US11429286B2Information processing apparatus and recording medium storing information processing programFUJITSU LTD·Filed 2020·Granted Aug 30, 2022·1 cites·11 claims
- 2176US10786974B2Stainless steel foilNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2016·Granted Sep 29, 2020·1 cites·20 claims
- 2276US8102061B2Semiconductor device bonding wire and wire bonding methodUNO TOMOHIRO·Filed 2008·Granted Jan 24, 2012·6 cites·10 claims
- 2375US12300658B2Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted May 13, 2025·0 cites·3 claims
- 2475US10789228B2Data presence/absence determination apparatus and computer-readable storage medium storing program for determination of data presence/absenceFUJITSU LTD·Filed 2018·Granted Sep 29, 2020·2 cites·11 claims
- 2575US10771011B2Circuit device, oscillator, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2019·Granted Sep 8, 2020·1 cites·15 claims
- 2672US9543266B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 10, 2017·2 cites·5 claims
- 2771US10737356B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Aug 11, 2020·1 cites·9 claims
- 2871US10414002B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Sep 17, 2019·1 cites·10 claims
- 2970US12463590B2Oscillator and method of manufacturing first oscillator and second oscillatorSEIKO EPSON CORP·Filed 2024·Granted Nov 4, 2025·0 cites·12 claims
- 3070US8299356B2Bonding wire for semiconductor devicesUNO TOMOHIRO·Filed 2008·Granted Oct 30, 2012·4 cites·26 claims
- 3169US12412864B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·7 claims
- 3269US8610291B2Copper alloy bonding wire for semiconductor deviceUNO TOMOHIRO·Filed 2007·Granted Dec 17, 2013·3 cites·13 claims
- 3368US8247911B2Wire bonding structure and method for forming sameUNO TOMOHIRO·Filed 2008·Granted Aug 21, 2012·4 cites·26 claims
- 3466US10468370B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 5, 2019·1 cites·7 claims
- 3566US5761779AMethod of producing fine metal spheres of uniform sizeNIPPON STEEL CORP·Filed 1996·Granted Jun 9, 1998·31 cites·19 claims
- 3665US7969021B2Bonding wire for semiconductor device and method for producing the sameNIPPON STEEL CORP·Filed 2001·Granted Jun 28, 2011·12 cites·35 claims
- 3764US10840208B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Nov 17, 2020·1 cites·12 claims
- 3864US10672733B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 3963US10844457B2Ferritic stainless steel foilNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2016·Granted Nov 24, 2020·0 cites·7 claims
- 4063US2024421091A1Integrated Circuit Apparatus And OscillatorSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 4162US9812421B2Bonding wire for semiconductor devicesNIPPON STEEL & SUMIKIN MAT CO·Filed 2014·Granted Nov 7, 2017·1 cites·9 claims
- 4262US7830008B2Gold wire for connecting semiconductor chipNIPPON STEEL MATERIALS CO LTD·Filed 2006·Granted Nov 9, 2010·2 cites·8 claims
- 4361US9427830B2Copper alloy bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 30, 2016·1 cites·8 claims
- 4461US9331049B2Bonding structure of bonding wireUNO TOMOHIRO·Filed 2009·Granted May 3, 2016·2 cites·15 claims
- 4561US8815019B2Bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 26, 2014·1 cites·21 claims
- 4660US10497663B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Dec 3, 2019·0 cites·21 claims
- 4759US12457744B2Three-dimensional memory device and method of making thereof using selective metal nitride deposition on dielectric metal oxide blocking dielectricSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 28, 2025·0 cites·4 claims
- 4858US12166006B2Bonding wire for semiconductor devicesNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·9 claims
- 4958US2020013748A1Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Application pending·0 cites
- 5057US12334467B2Copper bonding wireNIPPON MICROMETAL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·7 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →