Inventor · disambiguated record
Tse Ming Chu
Also filed as: CHU TSE MING
2 granted patents·4 pending applications·3 citations·filing 2007–2012
39Inventor score
Top patents by PatentIndex Score
6 records- 0157US8299629B2Wafer-bump structureCHU KUEI-WU·Filed 2011·Granted Oct 30, 2012·3 cites·9 claims
- 0233US2010133686A1Chip package structureCHU TSE-MING·Filed 2009·Application pending·0 cites
- 0332US2011176021A1Image-Processing Integrated CircuitMAO BANG ELECTRONIC CO LTD·Filed 2010·Application pending·0 cites
- 0428US8937386B2Chip package structure with ENIG platingCHU TSE-MING·Filed 2012·Granted Jan 20, 2015·0 cites·6 claims
- 0524US2010244200A1Integrated circuit connecting structure having flexible layoutCHU TSE MING·Filed 2007·Application pending·0 cites
- 0623US2012074558A1Circuit Board Packaged with Die through Surface Mount TechnologyLU HSUAN YU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →