Inventor · disambiguated record
Tsung Nan Lo
Also filed as: LO TSUNG NAN
4 granted patents·2 pending applications·11 citations·filing 2018–2023
66Inventor score
Technology areasH10W
Files withNXP BV6
Top patents by PatentIndex Score
6 records- 0188US12288770B2Semiconductor packages with embedded wiring on re-distributed bumpsNXP BV·Filed 2022·Granted Apr 29, 2025·2 cites·10 claims
- 0286US10390440B1Solderless inter-component jointsNXP BV·Filed 2018·Granted Aug 20, 2019·8 cites·15 claims
- 0372US11728308B2Semiconductor device under bump structure and method thereforNXP BV·Filed 2021·Granted Aug 15, 2023·1 cites·13 claims
- 0457US2023307402A1Semiconductor device under bump structure and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0555US12406951B2Redistribution layer having a sideview zig-zag profileNXP BV·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 0650US2024105659A1Semiconductor device with redistribution metallization and method thereforNXP BV·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →