Inventor · disambiguated record
Tsung-Fu Tsai
Also filed as: TSAI TSUNG-FU
67 granted patents·52 pending applications·251 citations·filing 2009–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD99TSAI TSUNG-FU7TAIWAN SEMICONDUCTOR MFG6CHANG CHIH-HORNG2TU CHIA-WEI2
Top patents by PatentIndex Score
119 records- 0198US11521905B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·5 cites·20 claims
- 0297US11355454B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·7 cites·20 claims
- 0397US9196532B2Integrated circuit packages and methods for forming the sameTU CHIA-WEI·Filed 2012·Granted Nov 24, 2015·67 cites·20 claims
- 0497US8846548B2Post-passivation interconnect structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 30, 2014·56 cites·22 claims
- 0596US11990351B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·3 cites·20 claims
- 0696US10157888B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 0795US11769739B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 0894US11508692B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·3 cites·20 claims
- 0994US8581420B2Under-bump metallization (UBM) structure and method of forming the sameTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·21 cites·20 claims
- 1093US12272568B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·1 cites·20 claims
- 1193US12119324B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 15, 2024·1 cites·20 claims
- 1293US11164824B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·3 cites·20 claims
- 1392US11948896B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·1 cites·20 claims
- 1492US11923259B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·1 cites·20 claims
- 1587US10985140B2Structure and formation method of package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·3 cites·20 claims
- 1687US10923438B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·3 cites·20 claims
- 1787US8569886B2Methods and apparatus of under bump metallization in packaging semiconductor devicesTU CHIA-WEI·Filed 2011·Granted Oct 29, 2013·8 cites·20 claims
- 1887US2025357353A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1986US10056312B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·19 claims
- 2085US12020952B2Method of fabricating semiconductor device having dummy micro bumps between stacking diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·1 cites·20 claims
- 2185US11476205B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 18, 2022·1 cites·20 claims
- 2285US8994155B2Packaging devices, methods of manufacture thereof, and packaging methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·7 cites·20 claims
- 2383US8130509B2Package carrierTSAI TSUNG-FU·Filed 2009·Granted Mar 6, 2012·11 cites·23 claims
- 2483US2025314826A1Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2583US2025347869A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2683US2025347871A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2782US2025334755A1Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2882US2024387197A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2981US9780009B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·2 cites·20 claims
- 3081US2024203906A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3181US2025266356A1Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3280US12412841B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 3380US9064881B2Protecting flip-chip package using pre-applied filletTSAI TSUNG-FU·Filed 2010·Granted Jun 23, 2015·4 cites·20 claims
- 3480US2024385378A1Photonic Package and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3580US2025355170A1Photonic Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3680US2024387432A1Semiconductor device, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3780US2025334760A1Detachable fiber array unit fitting with guide pinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3879US12315806B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 3979US12142579B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 4079US2025201583A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4179US2024371821A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4279US2025347878A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4379US2025349620A1Method of Singulating a Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4477US10770366B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·1 cites·20 claims
- 4577US8581399B2Metal bump structureTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·5 cites·19 claims
- 4677US2025172769A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4776US12046561B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 4876US2025076594A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4976US2025316642A1Device Bonding Apparatus and Method of Manufacturing a Package Using the ApparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5076US2024304466A1Method of fabricating semiconductor device having dummy micro bumps between stacking diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 119 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →