Inventor · disambiguated record
Tung-Bao Lu
Also filed as: LU TUNG BAO
6 granted patents·2 pending applications·20 citations·filing 2013–2016
77Inventor score
Files withCHIPMOS TECHNOLOGIES INC8
Top patents by PatentIndex Score
8 records- 0188US9721913B2Semiconductor package and method of manufacturing thereofCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Aug 1, 2017·3 cites·9 claims
- 0285US8779604B1Semiconductor structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Jul 15, 2014·9 cites·25 claims
- 0378US8877630B1Semiconductor structure having a silver alloy bump body and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Nov 4, 2014·5 cites·6 claims
- 0477US9780056B1Solder ball, manufacturing method thereof, and semiconductor deviceCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Oct 3, 2017·3 cites·17 claims
- 0552US2016308100A1Semiconductor package and method of manufacturing thereofCHIPMOS TECHNOLOGIES INC·Filed 2015·Application pending·0 cites
- 0642US9865777B2Semicondcutor light-emitting device and fabricating method thereofCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Jan 9, 2018·0 cites·10 claims
- 0741US2015171039A1Redistribution layer alloy structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 0838US9620445B1Chip package structure and method of manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Apr 11, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →