Inventor · disambiguated record
Tzy-Kuang Lee
Also filed as: LEE Tzy-Kuang
14 granted patents·7 pending applications·6 citations·filing 2015–2025
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21
Top patents by PatentIndex Score
21 records- 0183US10156478B2System and method of monitoring and controlling temperature of semiconductor substrates in FOUPTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·4 cites·20 claims
- 0280US12354959B2Redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0380US11450567B2Package component with stepped passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·1 cites·20 claims
- 0479US2024387380A1Redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0577US2023253204A1Blocking Structures on Isolation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0676US10283361B1Blocking structures on isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·1 cites·20 claims
- 0775US2024379428A1Semiconductor structure with pull-in planarization layer and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0872US11670594B2Redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 0972US11621165B2Blocking structures on isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 1072US2024222194A1Package component with stepped passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1171US11961762B2Package component with stepped passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 1269US2025300103A1Passivation Structure for Metal PatternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1368US12255131B2Capacitor between two passivation layers with different etching ratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1466US2022384259A1Semiconductor Structure with Pull-in Planarization Layer and Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1564US10930502B2Blocking structures on isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 1662US12374638B2Passivation structure for metal patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1760US2025183153A1Capacitor between two passivation layers with different etching ratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1855US12266684B2High density capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1951US12051622B2Passivation layer and planarization layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
- 2048US11935826B2Capacitor between two passivation layers with different etching ratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 2136US9934925B2Fuse structures and forming and operation methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →