Inventor · disambiguated record
Venkatesan Murali
Also filed as: MURALI VENKATESAN
49 granted patents·15 pending applications·1,037 citations·filing 1989–2022
98Inventor score
Top patents by PatentIndex Score
64 records- 0199US6687427B2Optic switchINTEL CORP·Filed 2000·Granted Feb 3, 2004·297 cites·19 claims
- 0294US8569096B1Free-standing metallic article for semiconductorsGTAT CORP·Filed 2013·Granted Oct 29, 2013·20 cites·30 claims
- 0392US8916038B2Free-standing metallic article for semiconductorsGTAT CORP·Filed 2013·Granted Dec 23, 2014·6 cites·23 claims
- 0492US8173452B1Method to form a device by constructing a support element on a thin semiconductor laminaPETTI CHRISTOPHER J·Filed 2010·Granted May 8, 2012·9 cites·28 claims
- 0591US8101451B1Method to form a device including an annealed lamina and having amorphous silicon on opposing facesMURALI VENKATESAN·Filed 2010·Granted Jan 24, 2012·13 cites·14 claims
- 0690US8936709B2Adaptable free-standing metallic article for semiconductorsGTAT CORP·Filed 2013·Granted Jan 20, 2015·6 cites·29 claims
- 0790US8257995B2Microwave anneal of a thin lamina for use in a photovoltaic cellHILALI MOHAMED M·Filed 2009·Granted Sep 4, 2012·18 cites·23 claims
- 0890US6650817B2Multi-level waveguideINTEL CORP·Filed 2002·Granted Nov 18, 2003·32 cites·13 claims
- 0988US5047367AProcess for formation of a self aligned titanium nitride/cobalt silicide bilayerINTEL CORP·Filed 1990·Granted Sep 10, 1991·138 cites·37 claims
- 1087US7066657B2Optical subassemblyINTEL CORP·Filed 2000·Granted Jun 27, 2006·38 cites·6 claims
- 1186US5492235AProcess for single mask C4 solder bump fabricationINTEL CORP·Filed 1994·Granted Feb 20, 1996·112 cites·28 claims
- 1285US8115304B1Method of implementing a discrete element in an integrated circuitJOSHI MUKUL·Filed 2008·Granted Feb 14, 2012·15 cites·18 claims
- 1384US4966868AProcess for selective contact hole filling including a silicide plugINTEL CORP·Filed 1989·Granted Oct 30, 1990·49 cites·6 claims
- 1479US8886481B1Reducing variation in multi-die integrated circuitsRAHMAN ARIFUR·Filed 2010·Granted Nov 11, 2014·4 cites·19 claims
- 1579US8629061B2Method for three-dimensional packaging of electronic devicesMURALI VENKATESAN·Filed 2012·Granted Jan 14, 2014·5 cites·5 claims
- 1679US6450699B1Photonic and electronic components on a shared substrateINTEL CORP·Filed 2000·Granted Sep 17, 2002·29 cites·16 claims
- 1777US8940998B2Free-standing metallic article for semiconductorsGTAT CORP·Filed 2013·Granted Jan 27, 2015·1 cites·25 claims
- 1876US8785294B2Silicon carbide laminaMURALI VENKATESAN·Filed 2012·Granted Jul 22, 2014·4 cites·18 claims
- 1973US7141448B2Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materialsINTEL CORP·Filed 2001·Granted Nov 28, 2006·17 cites·13 claims
- 2072US6731843B2Multi-level waveguideINTEL CORP·Filed 2000·Granted May 4, 2004·9 cites·9 claims
- 2171US9627261B1Multi-chip integrated circuitXILINX INC·Filed 2014·Granted Apr 18, 2017·2 cites·15 claims
- 2269US7000434B2Method of creating an angled waveguide using lithographic techniquesINTEL CORP·Filed 2000·Granted Feb 21, 2006·9 cites·4 claims
- 2369US5567981ABonding pad structure having an interposed rigid layerINTEL CORP·Filed 1993·Granted Oct 22, 1996·40 cites·30 claims
- 2468US6819836B2Photonic and electronic components on a shared substrate with through substrate communicationINTEL CORP·Filed 2000·Granted Nov 16, 2004·14 cites·18 claims
- 2566US8518724B2Method to form a device by constructing a support element on a thin semiconductor laminaPETTI CHRISTOPHER J·Filed 2012·Granted Aug 27, 2013·0 cites·20 claims
- 2666US6265300B1Wire bonding surface and bonding methodINTEL CORP·Filed 1993·Granted Jul 24, 2001·35 cites·23 claims
- 2766US2016027947A1Free-standing metallic article for semiconductorsGTAT CORPOTATION·Filed 2014·Application pending·0 cites
- 2864US6633707B1Lithographically defined optic arrayINTEL CORP·Filed 2000·Granted Oct 14, 2003·8 cites·23 claims
- 2963US10886424B2Method for blackening a metallic articleMERLIN SOLAR TECH INC·Filed 2019·Granted Jan 5, 2021·0 cites·17 claims
- 3063US6219910B1Method for cutting integrated circuit dies from a wafer which contains a plurality of solder bumpsINTEL CORP·Filed 1999·Granted Apr 24, 2001·20 cites·18 claims
- 3162US11588064B2Method for blackening a metallic articleMERLIN SOLAR TECH INC·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 3262US11349040B2Photovoltaic cell having a coupled expanded metal articleMERLIN SOLAR TECH INC·Filed 2020·Granted May 31, 2022·0 cites·13 claims
- 3361US2019341514A1Cell-to-cell interconnectMERLIN SOLAR TECH INC·Filed 2017·Application pending·0 cites
- 3460US6869882B2Method of creating a photonic via using depositionINTEL CORP·Filed 2000·Granted Mar 22, 2005·6 cites·7 claims
- 3560US6331446B1Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel stateINTEL CORP·Filed 1999·Granted Dec 18, 2001·25 cites·35 claims
- 3660US2015007877A1Polysilazane coating for photovoltaic cellsGTAT CORP·Filed 2014·Application pending·0 cites
- 3758US6963684B2Multi-band arrayed waveguide grating with improved insertion loss and wavelength accuracyJDS UNIPHASE CORP·Filed 2002·Granted Nov 8, 2005·6 cites·9 claims
- 3858US6650823B1Method of creating a photonic via using fiber opticINTEL CORP·Filed 2000·Granted Nov 18, 2003·5 cites·18 claims
- 3958US2017373211A1Cell-to-cell interconnectMERLIN SOLAR TECH INC·Filed 2016·Application pending·0 cites
- 4057US8841161B2Method for forming flexible solar cellsMURALI VENKATESAN·Filed 2012·Granted Sep 23, 2014·0 cites·15 claims
- 4157US7095937B2Multi-level waveguideINTEL CORP·Filed 2003·Granted Aug 22, 2006·3 cites·6 claims
- 4256US8916954B2Multi-layer metal supportMURALI VENKATESAN·Filed 2012·Granted Dec 23, 2014·0 cites·24 claims
- 4356US6928216B2Markings for aligning fiber optic bundleINTEL CORP·Filed 2003·Granted Aug 9, 2005·4 cites·7 claims
- 4456US2023101622A1Method for blackening an electrical conduitMERLIN SOLAR TECH INC·Filed 2022·Application pending·0 cites
- 4555US10672927B2Photovoltaic cell having a coupled expanded metal articleMERLIN SOLAR TECH INC·Filed 2019·Granted Jun 2, 2020·0 cites·14 claims
- 4653US6788836B2Multi-level waveguideINTEL CORP·Filed 2002·Granted Sep 7, 2004·2 cites·9 claims
- 4752US2014261661A1Free-standing metallic article with overplatingGTAT CORP·Filed 2013·Application pending·0 cites
- 4852US2012258561A1Low-Temperature Method for Forming Amorphous Semiconductor LayersLI JIAN·Filed 2011·Application pending·0 cites
- 4952US2013330871A1Methods for texturing a semiconductor materialNEWMAN BONNA·Filed 2012·Application pending·0 cites
- 5051US6248951B1Dielectric decal for a substrate of an integrated circuit packageINTEL CORP·Filed 1999·Granted Jun 19, 2001·17 cites·20 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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