Inventor · disambiguated record
Vikash Banthia
Also filed as: BANTHIA VIKASH
20 granted patents·13 pending applications·434 citations·filing 2000–2023
94Inventor score
Top patents by PatentIndex Score
33 records- 0198US7939422B2Methods of thin film processAPPLIED MATERIALS INC·Filed 2007·Granted May 10, 2011·240 cites·25 claims
- 0296US7335609B2Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Feb 26, 2008·70 cites·18 claims
- 0389US7456116B2Gap-fill depositions in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2004·Granted Nov 25, 2008·42 cites·16 claims
- 0486US10256144B2Process integration approach of selective tungsten via fillAPPLIED MATERIALS INC·Filed 2017·Granted Apr 9, 2019·5 cites·20 claims
- 0586US6843882B2Gas flow control in a wafer processing system having multiple chambers for performing same processAPPLIED MATERIALS INC·Filed 2002·Granted Jan 18, 2005·47 cites·8 claims
- 0685US12293902B2Process kit for a substrate supportAPPLIED MATERIALS INC·Filed 2022·Granted May 6, 2025·1 cites·20 claims
- 0782US10395916B2In-situ pre-clean for selectivity improvement for selective depositionAPPLIED MATERIALS INC·Filed 2017·Granted Aug 27, 2019·3 cites·20 claims
- 0878US11387134B2Process kit for a substrate supportAPPLIED MATERIALS INC·Filed 2019·Granted Jul 12, 2022·2 cites·19 claims
- 0978US10727119B2Process integration approach of selective tungsten via fillAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·2 cites·20 claims
- 1076US10704147B2Process kit design for in-chamber heater and wafer rotating mechanismAPPLIED MATERIALS INC·Filed 2017·Granted Jul 7, 2020·2 cites·20 claims
- 1176US9947578B2Methods for forming low-resistance contacts through integrated process flow systemsAPPLIED MATERIALS INC·Filed 2016·Granted Apr 17, 2018·2 cites·19 claims
- 1274US7642171B2Multi-step anneal of thin films for film densification and improved gap-fillAPPLIED MATERIALS INC·Filed 2004·Granted Jan 5, 2010·15 cites·26 claims
- 1373US10508339B2Blocker plate for use in a substrate process chamberAPPLIED MATERIALS INC·Filed 2017·Granted Dec 17, 2019·1 cites·11 claims
- 1472US9595466B2Methods for etching via atomic layer deposition (ALD) cyclesAPPLIED MATERIALS INC·Filed 2015·Granted Mar 14, 2017·2 cites·19 claims
- 1561US11421322B2Blocker plate for use in a substrate process chamberAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·0 cites·16 claims
- 1659US11249386B2Extreme ultraviolet mask with backside coatingAPPLIED MATERIALS INC·Filed 2019·Granted Feb 15, 2022·0 cites·20 claims
- 1759US2025087505A1Microwave annealing for low thermal budget applicationsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1853US2019385838A1In-Situ Pre-Clean For Selectivity Improvement For Selective DepositionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1951US11355391B2Method for forming a metal gapfillAPPLIED MATERIALS INC·Filed 2020·Granted Jun 7, 2022·0 cites·19 claims
- 2051US2008115726A1gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2150US10879081B2Methods of reducing or eliminating defects in tungsten filmAPPLIED MATERIALS INC·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 2250US10535527B2Methods for depositing semiconductor filmsAPPLIED MATERIALS INC·Filed 2018·Granted Jan 14, 2020·0 cites·17 claims
- 2349US2007000897A1Multi-step anneal of thin films for film densification and improved gap-fillAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2447US2011151676A1Methods of thin film processAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 2544US2007212847A1Multi-step anneal of thin films for film densification and improved gap-fillAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2642US2014304021A1Method for Brokering Purchases of Procedural ServicesBANTHIA VIKASH·Filed 2014·Application pending·0 cites
- 2741US2019017165A1Methods And Apparatus For Depositing Tungsten Nucleation LayersAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2839US2013297329A1Method for Brokering Purchases of Procedural ServicesBANTHIA VIKASH·Filed 2012·Application pending·0 cites
- 2938US2018145034A1Methods To Selectively Deposit Corrosion-Free Metal ContactsAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3037US10256076B2Substrate processing apparatus and methodsAPPLIED MATERIALS INC·Filed 2015·Granted Apr 9, 2019·0 cites·18 claims
- 3137US2018144973A1Electromigration Improvement Using Tungsten For Selective Cobalt Deposition On Copper SurfacesAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3235US2016300731A1Methods of etchback profile tuningAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 3333US2002006677A1Detection of contaminants on semiconductor wafersFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →