Inventor · disambiguated record
Wan Lay Looi
Also filed as: LOOI WAN LAY
5 granted patents·29 citations·filing 2004–2006
75Inventor score
Top patents by PatentIndex Score
5 records- 0189US8008770B2Integrated circuit package system with bump padSTATS CHIPPAC LTD·Filed 2006·Granted Aug 30, 2011·22 cites·20 claims
- 0265US7443039B2System for different bond pads in an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Oct 28, 2008·3 cites·10 claims
- 0361US7381634B2Integrated circuit system for bondingSTATS CHIPPAC LTD·Filed 2005·Granted Jun 3, 2008·2 cites·18 claims
- 0444US7005370B2Method of manufacturing different bond pads on the same substrate of an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·2 cites·10 claims
- 0540US8134196B2Integrated circuit system with metal-insulator-metal circuit elementLIN YAOJIAN·Filed 2006·Granted Mar 13, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →