Inventor · disambiguated record
Wen-Hsiung Chang
Also filed as: CHANG WEN-HSIUNG
33 granted patents·16 pending applications·574 citations·filing 1995–2024
97Inventor score
Files withCHANG WEN-HSIUNG8POWERTECH TECHNOLOGY INC6CLEVO CO3INEFFABLE CELLULAR LTD LIABILITY COMPANY3CHEN KUANG-HSIUNG2
Top patents by PatentIndex Score
49 records- 0198US8012797B2Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometriesADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 6, 2011·146 cites·20 claims
- 0297US5549127ASpring fixing structure for a hairgripFiled 1995·Granted Aug 27, 1996·101 cites·2 claims
- 0396USD381767SHair clipCHANG WEN-HSIUNG·Filed 1995·Granted Jul 29, 1997·75 cites·1 claims
- 0496USD381119SHair clipCHANG WEN-HSIUNG·Filed 1995·Granted Jul 15, 1997·76 cites·1 claims
- 0593US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0688US8623689B2Package process of backside illumination image sensorCHANG WEN-HSIUNG·Filed 2010·Granted Jan 7, 2014·5 cites·17 claims
- 0788US8258007B2Package processSHEN CHI-CHIH·Filed 2010·Granted Sep 4, 2012·10 cites·7 claims
- 0885US11309296B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Apr 19, 2022·4 cites·13 claims
- 0985US10124405B2Manufacturing method for metallic housing of electronic deviceFU ZHUN PREC INDUSTRY SHEN ZHEN CO LTD·Filed 2016·Granted Nov 13, 2018·2 cites·8 claims
- 1081US8351138B2Lens driving device, flexible piece and the method for manufacturing the flexible pieceWAH HONG IND CORP·Filed 2010·Granted Jan 8, 2013·6 cites·15 claims
- 1178US10040120B2Manufacturing method for metallic housing of electronic deviceFU ZHUN PREC INDUSTRY SHEN ZHEN CO LTD·Filed 2016·Granted Aug 7, 2018·1 cites·10 claims
- 1278US9370823B2Metallic housing of electronic device and manufacturing method thereofFU ZHUN PRECISION IND SHENZHEN·Filed 2013·Granted Jun 21, 2016·4 cites·9 claims
- 1376US12439609B2Process technique for embedded memoryHEFEI RELIANCE MEMORY LTD·Filed 2024·Granted Oct 7, 2025·0 cites·5 claims
- 1474US8747532B2Filter deviceCHANG CHUN-JUNG·Filed 2011·Granted Jun 10, 2014·6 cites·15 claims
- 1568US8293640B2Semiconductor structure and manufacturing method thereofCHANG WEN-HSIUNG·Filed 2010·Granted Oct 23, 2012·2 cites·8 claims
- 1668US2018141114A1Metallic articleHONGFUJIN PREC IND SHENZHEN·Filed 2018·Application pending·0 cites
- 1767US5697388AHair clip improvementFiled 1995·Granted Dec 16, 1997·29 cites·1 claims
- 1866US7260318B2Computer device capable of playing DVD films without the need of executing an operating systemCLEVO CO·Filed 2003·Granted Aug 21, 2007·9 cites·6 claims
- 1965US9281332B2Package process of backside illumination image sensorINEFFABLE CELLULAR LTD LIABILITY COMPANY·Filed 2012·Granted Mar 8, 2016·0 cites·14 claims
- 2064US5722437AHair clipFiled 1996·Granted Mar 3, 1998·26 cites·2 claims
- 2162US8460971B2Semiconductor device packaging structure and packaging methodCHANG WEN-HSIUNG·Filed 2010·Granted Jun 11, 2013·1 cites·6 claims
- 2261US9901979B2Metallic article and method for manufacturing metallic articleHONGFUJIN PREC IND SHENZHEN·Filed 2015·Granted Feb 27, 2018·0 cites·13 claims
- 2354US10424526B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Sep 24, 2019·0 cites·16 claims
- 2454US9358606B2Metallic housing of electronic device and manufacturing method thereofFU ZHUN PRECISION IND SHENZHEN·Filed 2013·Granted Jun 7, 2016·0 cites·7 claims
- 2553US11522000B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Dec 6, 2022·0 cites·8 claims
- 2651US9070672B2Semiconductor device packaging structure and packaging methodINEFFABLE CELLULAR LTD LIABILITY COMPANY·Filed 2013·Granted Jun 30, 2015·0 cites·20 claims
- 2751US8685860B2Semiconductor structure and manufacturing method thereofINEFFABLE CELLULAR LTD LIABILITY COMPANY·Filed 2012·Granted Apr 1, 2014·0 cites·18 claims
- 2847US2012205800A1Packaging structureSHEN CHI-CHIH·Filed 2012·Application pending·0 cites
- 2946US2004040569A1Hair clipFiled 2002·Application pending·0 cites
- 3046US2003196675A1Hairclip with a twistable pivotFiled 2002·Application pending·0 cites
- 3145US2007129101A1Telecommunication notebook computerCLEVO CO·Filed 2006·Application pending·0 cites
- 3244US2021098324A1Optoelectronic chip scale package with patterned dam structurePOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 3344US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 3442US8946085B2Semiconductor process and structureCHANG WEN-HSIUNG·Filed 2010·Granted Feb 3, 2015·0 cites·13 claims
- 3541US2004257320A1Computer device capable of displaying television programs without the need of executing an operating systemFiled 2003·Application pending·0 cites
- 3641US2006292775A1Method of manufacturing DRAM capable of avoiding bit line leakageNANYA TECHNOLOGY CORP·Filed 2005·Application pending·0 cites
- 3740US8563405B2Method for manufacturing semiconductor deviceCHANG WEN-HSIUNG·Filed 2010·Granted Oct 22, 2013·0 cites·14 claims
- 3839US2007104452A1One-click video recording system and methodCLEVO CO·Filed 2006·Application pending·0 cites
- 3938US2004030937A1Computer remotely controlled by remote controllerFiled 2002·Application pending·0 cites
- 4038US2012049332A1Semiconductor package and method for manufacturing the sameCHEN JEN-CHUAN·Filed 2011·Application pending·0 cites
- 4137US9373391B1Resistive memory apparatusWINBOND ELECTRONICS CORP·Filed 2015·Granted Jun 21, 2016·0 cites·13 claims
- 4237US6102049AHair holding deviceFiled 1999·Granted Aug 15, 2000·8 cites·4 claims
- 4337US5950637AHair holding deviceFiled 1999·Granted Sep 14, 1999·8 cites·6 claims
- 4437US2011294237A1Packaging method of semiconductor deviceCHANG WEN-HSIUNG·Filed 2010·Application pending·0 cites
- 4537US2016309903A1Folding stoolHONG FU JIN PREC IND (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
- 4636US9972554B2Wafer level chip scale package having continuous through hole via configuration and fabrication method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted May 15, 2018·0 cites·19 claims
- 4735US2004030936A1Notebook computer having temperature adjustment functionFiled 2002·Application pending·0 cites
- 4831US5964228AHair holderFiled 1999·Granted Oct 12, 1999·3 cites·2 claims
- 4927US2019096866A1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →