Inventor · disambiguated record
Wei Fang
Also filed as: FANG WEI · FANG WEI-LI
64 granted patents·14 pending applications·199 citations·filing 2007–2025
98Inventor score
Top patents by PatentIndex Score
78 records- 0195US11126089B2Method for determining corrections to features of a maskASML NETHERLANDS BV·Filed 2020·Granted Sep 21, 2021·5 cites·20 claims
- 0292US11216938B2Systems and methods of optimal metrology guidanceASML NETHERLANDS BV·Filed 2019·Granted Jan 4, 2022·9 cites·15 claims
- 0391US8068662B2Method and system for determining a defect during charged particle beam inspection of a sampleZhang zhao-li·Filed 2009·Granted Nov 29, 2011·46 cites·19 claims
- 0487US8759762B2Method and apparatus for identifying plug-to-plug short from a charged particle microscopic imageXIAO HONG·Filed 2009·Granted Jun 24, 2014·13 cites·20 claims
- 0586US11861818B2Cascade defect inspectionASML NETHERLANDS BV·Filed 2022·Granted Jan 2, 2024·1 cites·20 claims
- 0686US9953803B2Local alignment point calibration method in die inspectionHERMES MICROVISION INC·Filed 2016·Granted Apr 24, 2018·3 cites·24 claims
- 0786US9541824B1Method and system for fast inspecting defectsHERMES MICROVISION INC·Filed 2014·Granted Jan 10, 2017·7 cites·12 claims
- 0886US9251581B1Methods for promoting semiconductor manufacturing yield and classifying defects during fabricating a semiconductor device, and computer readable mediums encoded with a computer program implementing the sameCHEN SHIH-TSUNG·Filed 2011·Granted Feb 2, 2016·14 cites·14 claims
- 0985US9282293B2Method and system for measuring critical dimension and monitoring fabrication uniformityHERMES MICROVISION INC·Filed 2013·Granted Mar 8, 2016·4 cites·14 claims
- 1085US8884224B2Charged particle beam imaging assembly and imaging method thereofFANG WEI·Filed 2009·Granted Nov 11, 2014·9 cites·20 claims
- 1185US8712184B1Method and system for filtering noises in an image scanned by charged particlesLIAO CHAD·Filed 2011·Granted Apr 29, 2014·20 cites·18 claims
- 1283US10102619B1Inspection method and systemHERMES MICROVISION INC·Filed 2015·Granted Oct 16, 2018·4 cites·55 claims
- 1382US9100553B2Method and system for measuring critical dimension and monitoring fabrication uniformityHERMES MICROVISION INC·Filed 2013·Granted Aug 4, 2015·3 cites·7 claims
- 1481US11527405B2In-die metrology methods and systems for process controlASML NETHERLANDS BV·Filed 2019·Granted Dec 13, 2022·2 cites·15 claims
- 1581US9041795B2Method and system for measuring critical dimension and monitoring fabrication uniformityHERMES MICROVISION INC·Filed 2013·Granted May 26, 2015·3 cites·6 claims
- 1679US11175590B2Low dose charged particle metrology systemASML NETHERLANDS BV·Filed 2018·Granted Nov 16, 2021·2 cites·19 claims
- 1779US8094924B2E-beam defect review systemJAU JACK·Filed 2008·Granted Jan 10, 2012·8 cites·5 claims
- 1878US10497538B2Local alignment point calibration method in die inspectionASML NETHERLANDS BV·Filed 2018·Granted Dec 3, 2019·1 cites·18 claims
- 1977US9494856B1Method and system for fast inspecting defectsFANG WEI·Filed 2011·Granted Nov 15, 2016·2 cites·17 claims
- 2077US8937281B2Method for examining a sample by using a charged particle beamZHAO YAN·Filed 2012·Granted Jan 20, 2015·3 cites·22 claims
- 2177US2025006456A1Cross-talk cancellation in multiple charged-particle beam inspectionASML NETHERLANDS BV·Filed 2024·Application pending·0 cites
- 2276US10380731B1Method and system for fast inspecting defectsHERMES MICROVISION INC·Filed 2015·Granted Aug 13, 2019·2 cites·7 claims
- 2376US8606017B1Method for inspecting localized image and system thereofFANG WEI·Filed 2011·Granted Dec 10, 2013·7 cites·26 claims
- 2476US8432441B2Method and system for measuring critical dimension and monitoring fabrication uniformityFANG WEI·Filed 2011·Granted Apr 30, 2013·3 cites·4 claims
- 2576US8010307B2In-line overlay measurement using charged particle beam systemHERMES MICROVISION INC·Filed 2007·Granted Aug 30, 2011·5 cites·13 claims
- 2675US11880971B2Inspection method and systemASML NETHERLANDS BV·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 2775US11087954B2System and method for bare wafer inspectionASML NETHERLANDS BV·Filed 2019·Granted Aug 10, 2021·1 cites·15 claims
- 2875US8299431B2Method for examining a sample by using a charged particle beamZHAO YAN·Filed 2009·Granted Oct 30, 2012·3 cites·20 claims
- 2975US2025078478A1Fully automated sem sampling system for e-beam image enhancementASML NETHERLANDS BV·Filed 2024·Application pending·0 cites
- 3074US12230013B2Fully automated SEM sampling system for e-beam image enhancementASML NETHERLANDS BV·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 3174US11756182B2Pattern grouping method based on machine learningASML NETHERLANDS BV·Filed 2019·Granted Sep 12, 2023·2 cites·18 claims
- 3274US11650576B2Knowledge recommendation for defect reviewASML NETHERLANDS BV·Filed 2018·Granted May 16, 2023·2 cites·12 claims
- 3374US8050490B2Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereofHERMES MICROVISION INC·Filed 2009·Granted Nov 1, 2011·4 cites·25 claims
- 3473US12040187B2In-die metrology methods and systems for process controlASML NETHERLANDS BV·Filed 2022·Granted Jul 16, 2024·0 cites·15 claims
- 3573US8217349B2Method for inspecting EUV reticle and apparatus thereofKUAN CHIYAN·Filed 2010·Granted Jul 10, 2012·3 cites·9 claims
- 3673US2025166960A1Sem image enhancement methods and systemsASML NETHERLANDS BV·Filed 2024·Application pending·0 cites
- 3771US2022253999A1EBeam Inspection MethodASML NETHERLANDS BV·Filed 2022·Application pending·0 cites
- 3870US11842420B2Method and apparatus for adaptive alignmentASML NETHERLANDS BV·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 3970US11720030B2Low dose charged particle metrology systemASML NETHERLANDS BV·Filed 2021·Granted Aug 8, 2023·0 cites·17 claims
- 4070US11250559B2Inspection method and systemASML NETHERLANDS BV·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 4170US2023386021A1Pattern grouping method based on machine learningASML NETHERLANDS BV·Filed 2023·Application pending·0 cites
- 4269US9436988B2Method and system of classifying defects on a waferHERMES-MICROVISION INC·Filed 2014·Granted Sep 6, 2016·2 cites·15 claims
- 4369US2025226174A1System and method for defect inspection using voltage contrast in a charged particle systemASML NETHERLANDS BV·Filed 2025·Application pending·0 cites
- 4468US11756187B2Systems and methods of optimal metrology guidanceASML NETHERLANDS BV·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 4568US11238579B2Defect pattern grouping method and systemASML NETHERLANDS BV·Filed 2018·Granted Feb 1, 2022·2 cites·18 claims
- 4668US9965844B1Inspection method and systemHERMES MICROVISION INC·Filed 2016·Granted May 8, 2018·1 cites·23 claims
- 4767US12191112B2System and method for defect inspection using voltage contrast in a charged particle systemASML NETHERLANDS BV·Filed 2020·Granted Jan 7, 2025·0 cites·15 claims
- 4867US11791127B2System and method for bare wafer inspectionASML NETHERLANDS BV·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 4965US12080513B2Cross-talk cancellation in multiple charged-particle beam inspectionASML NETHERLANDS BV·Filed 2020·Granted Sep 3, 2024·0 cites·15 claims
- 5065US11043356B2Local alignment point calibration method in die inspectionASML NETHERLANDS BV·Filed 2019·Granted Jun 22, 2021·0 cites·24 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →