Inventor · disambiguated record

Wensen Hung

Also filed as: HUNG WENSEN

70 granted patents·36 pending applications·505 citations·filing 2010–2025

99Inventor score

Technology areasH10W H10P G01R Y10T H01L

Files withTAIWAN SEMICONDUCTOR MFG CO LTD91 TAIWAN SEMICONDUCTOR MFG10 KUO YUNG-HSIN3 HUNG WENSEN1 KUO YING-HSIN1

Top patents by PatentIndex Score

106 records

0198US11594469B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·6 cites·20 claims
0298US11282825B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
0398US10332823B2Packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·19 cites·20 claims
0498US9780072B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·25 cites·20 claims
0597US10461009B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·15 cites·20 claims
0697US10157818B2Methods of cooling packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·19 cites·20 claims
0797US10062665B2Semiconductor packages with thermal management features for reduced thermal crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·17 cites·20 claims
0897US9595506B2Packages with thermal management features for reduced thermal crosstalk and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 14, 2017·18 cites·20 claims
0997US9269694B2Packages with thermal management features for reduced thermal crosstalk and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 23, 2016·26 cites·20 claims
1097US9224673B2Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·26 cites·12 claims
1197US9082743B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 14, 2015·24 cites·20 claims
1297US9076754B23DIC packages with heat sinks attached to heat dissipating ringsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·34 cites·20 claims
1396US11810833B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
1496US9735082B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·19 claims
1596US9583415B2Packages with thermal interface material on the sidewalls of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·30 cites·19 claims
1696US9385095B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·19 cites·20 claims
1796US9287194B2Packaging devices and methods for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·26 cites·20 claims
1895US11929293B2Semiconductor package with lid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
1995US11062971B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·12 cites·20 claims
2095US10461014B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·10 cites·23 claims
2194US10867885B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·8 cites·20 claims
2293US10483187B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 19, 2019·7 cites·20 claims
2393US10446520B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 15, 2019·7 cites·20 claims
2493US10269682B2Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·9 cites·21 claims
2592US10157813B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
2692US9941251B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 10, 2018·6 cites·20 claims
2791US11302600B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·5 cites·19 claims
2891US10515867B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·6 cites·17 claims
2990US10978373B2Semiconductor device methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·5 cites·19 claims
3090US9184128B23DIC package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 10, 2015·7 cites·20 claims
3189US10685854B23DIC package comprising perforated foil sheetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 16, 2020·4 cites·20 claims
3289US10510687B2Packaging devices and methods for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
3388US9576938B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·4 cites·20 claims
3487US11018073B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·3 cites·20 claims
3586US8723538B2Probe head formation methods employing guide plate raising assembly mechanismHUNG WENSEN·Filed 2011·Granted May 13, 2014·10 cites·16 claims
3686US2024222218A13dic packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3785US9978660B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 22, 2018·5 cites·20 claims
3885US8907472B23DIC package comprising perforated foil sheetTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 9, 2014·5 cites·20 claims
3985US8832933B2Method of fabricating a semiconductor test probe headKUO YUNG-HSIN·Filed 2011·Granted Sep 16, 2014·10 cites·19 claims
4084US10153218B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·4 cites·20 claims
4184US9893021B2Packaging devices and methods for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·3 cites·19 claims
4284US8878560B2High frequency probing structureKUO YING-HSIN·Filed 2010·Granted Nov 4, 2014·14 cites·16 claims
4384US2025069980A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4483US12387988B2Method of manufacturing semiconductor package having lid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
4583US11257690B23DIC package comprising perforated foil sheetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·1 cites·20 claims
4682US11088048B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
4782US10867884B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·20 claims
4882US10629510B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
4982US2025309009A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
5081US12170237B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims

Showing the top 50 of 106 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →