Inventor · disambiguated record

Wen-Shiang Liao

Also filed as: LIAO WEN C · LIAO WEN-SHIANG

107 granted patents·50 pending applications·628 citations·filing 1997–2025

99Inventor score

Technology areasH10W H10P G02B H10D H01L

Files withTAIWAN SEMICONDUCTOR MFG CO LTD134 UNITED MICROELECTRONICS CORP10 VANGUARD INT SEMICONDUCT CORP4 LIAO WEN-SHIANG2 WINBOND ELECTRONICS CORP2

Top patents by PatentIndex Score

157 records

0199US11295979B2Semiconductor package device with integrated antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·7 cites·20 claims
0298US11699669B2Semiconductor package device with integrated inductor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 11, 2023·4 cites·20 claims
0398US10163825B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·24 cites·20 claims
0498US9941195B2Vertical metal insulator metal capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·26 cites·20 claims
0598US9711465B2Antenna cavity structure for integrated patch antenna in integrated fan-out packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·41 cites·20 claims
0697US11749625B2Semiconductor structure including one or more antenna structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 5, 2023·4 cites·20 claims
0797US9991216B2Antenna cavity structure for integrated patch antenna in integrated fan-out packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 5, 2018·22 cites·20 claims
0896US10923417B2Integrated fan-out package with 3D magnetic core inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 16, 2021·10 cites·20 claims
0996US10460987B2Semiconductor package device with integrated antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 29, 2019·11 cites·20 claims
1095US11953723B2Thermally tunable waveguide and photonic integrated circuit component having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·2 cites·20 claims
1195US10770414B2Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·10 cites·20 claims
1295US10283443B2Chip package having integrated capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·13 cites·20 claims
1395US6888181B1Triple gate device having strained-silicon channelUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 3, 2005·117 cites·10 claims
1494US10734279B2Semiconductor package device with integrated antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·8 cites·20 claims
1594US6855588B1Method of fabricating a double gate MOSFET deviceUNITED MICROELECTRONICS CORP·Filed 2003·Granted Feb 15, 2005·92 cites·16 claims
1693US11502402B2Integrated patch antenna having insulating substrate with antenna cavity and high-K dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·3 cites·19 claims
1792US12066662B2Apparatus for optical coupling and system for communicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·2 cites·20 claims
1892US11719885B2Apparatus for optical coupling and system for communicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·3 cites·20 claims
1992US2025357391A1Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2091US12170241B2Embedded metal insulator metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 17, 2024·1 cites·20 claims
2190US11442296B2Waveguide structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
2290US10037897B2Inter-fan-out wafer level packaging with coaxial TIV for 3D IC low-noise packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·7 cites·19 claims
2389US10269691B2Method of forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·5 cites·20 claims
2488US10468345B23D IC decoupling capacitor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·4 cites·20 claims
2588US10319690B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·6 cites·20 claims
2687US12500157B2Semiconductor package device with integrated inductor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
2787US6853031B2Structure of a trapezoid-triple-gate FETUNITED MICROELECTRONICS CORP·Filed 2003·Granted Feb 8, 2005·41 cites·13 claims
2887US2024395684A13dic package with interposer formed by spin on processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2987US2025355179A1Integrated optical devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3086US12272637B2Integrated fan-out package with 3D magnetic core inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·1 cites·20 claims
3186US12164152B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
3286US11688685B2Integrated fan-out package with 3D magnetic core inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
3385US11637078B2Coaxial through via with novel high isolation cross coupling method for 3D integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
3485US11428870B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·1 cites·20 claims
3585US10411328B2Patch antenna structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 10, 2019·4 cites·20 claims
3685US2025337155A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3785US2025060537A1Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3884US12306436B2Thermally tunable waveguide and photonic integrated circuit component having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 20, 2025·0 cites·20 claims
3984US11417594B23DIC package integration for high-frequency RF systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 16, 2022·2 cites·20 claims
4084US10930603B2Coaxial through via with novel high isolation cross coupling method for 3D integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 23, 2021·3 cites·20 claims
4184US10665536B23D IC Decoupling capacitor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 26, 2020·2 cites·20 claims
4284US6534402B1Method of fabricating self-aligned silicideWINBOND ELECTRONICS CORP·Filed 2001·Granted Mar 18, 2003·35 cites·12 claims
4383US11062988B23D IC decoupling capacitor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 13, 2021·1 cites·20 claims
4483US11024979B23D IC antenna array with laminated high-k dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 1, 2021·3 cites·19 claims
4583US2024363560A1Coaxial through via with novel high isolation cross coupling method for 3d integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4683US2024371916A1PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4782US12132074B2PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
4882US2025125519A1Semiconductor package with antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4982US2025364450A1Semiconductor die package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
5081US12469805B2Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims

Showing the top 50 of 157 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →