Inventor · disambiguated record
Wei-Da Lin
Also filed as: LIN WEI · LIN WEI-DA
3 granted patents·2 pending applications·0 citations·filing 2020–2024
46Inventor score
Top patents by PatentIndex Score
5 records- 0167US12068259B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Aug 20, 2024·0 cites·9 claims
- 0261US12283637B2MOS capacitor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 22, 2025·0 cites·7 claims
- 0355US11605598B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 14, 2023·0 cites·12 claims
- 0454US2024297261A1Semiconductor deviceLANDMARK OPTOELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0554US2022181505A1Mos capacitor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →