Inventor · disambiguated record
Wei-Chung Lo
Also filed as: LO WEI-CHUNG
23 granted patents·3 pending applications·225 citations·filing 2002–2020
95Inventor score
Top patents by PatentIndex Score
26 records- 0194US9647029B2Light-emitting device and manufacturing method of a displayIND TECH RES INST·Filed 2015·Granted May 9, 2017·14 cites·13 claims
- 0293US8810031B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2010·Granted Aug 19, 2014·27 cites·40 claims
- 0392US8304666B2Structure of multiple coaxial leads within single via in substrate and manufacturing method thereofKO CHENG-TA·Filed 2009·Granted Nov 6, 2012·41 cites·21 claims
- 0492US7329563B2Method for fabrication of wafer level package incorporating dual compliant layersIND TECH RES INST·Filed 2005·Granted Feb 12, 2008·34 cites·6 claims
- 0588US8049330B2Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channelsIND TECH RES INST·Filed 2005·Granted Nov 1, 2011·18 cites·24 claims
- 0684US9252054B2Thinned integrated circuit device and manufacturing process for the sameIND TECH RES INST·Filed 2014·Granted Feb 2, 2016·7 cites·18 claims
- 0784US6914333B2Wafer level package incorporating dual compliant layers and method for fabricationIND TECH RES INST·Filed 2002·Granted Jul 5, 2005·45 cites·16 claims
- 0883US9485874B2Package substrate having photo-sensitive dielectric layer and method of fabricating the sameIND TECH RES INST·Filed 2013·Granted Nov 1, 2016·7 cites·19 claims
- 0983US8164165B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2006·Granted Apr 24, 2012·10 cites·35 claims
- 1081US11854961B2Package substrate and method of fabricating the same and chip package structureIND TECH RES INST·Filed 2020·Granted Dec 26, 2023·1 cites·27 claims
- 1181US11004816B2Hetero-integrated structureIND TECH RES INST·Filed 2019·Granted May 11, 2021·3 cites·19 claims
- 1281US8915634B2Plane light source and flexible plane light sourceHSU CHAO-KAI·Filed 2012·Granted Dec 23, 2014·11 cites·23 claims
- 1378US10068847B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2017·Granted Sep 4, 2018·2 cites·4 claims
- 1478US9111774B2Wafer-to-wafer stack with supporting postIND TECH RES INST·Filed 2013·Granted Aug 18, 2015·3 cites·35 claims
- 1570US11791256B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2020·Granted Oct 17, 2023·0 cites·9 claims
- 1668US10276908B2Electromagnetic wave transmission board and differential electromagnetic wave transmission boardIND TECH RES INST·Filed 2017·Granted Apr 30, 2019·1 cites·17 claims
- 1759US7948072B2Wafer-to-wafer stackingIND TECH RES INST·Filed 2008·Granted May 24, 2011·1 cites·19 claims
- 1858US10867907B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2018·Granted Dec 15, 2020·0 cites·3 claims
- 1953US8679891B2Heterostructure containing IC and LED and method for fabricating the sameUNIV NAT CHIAO TUNG·Filed 2013·Granted Mar 25, 2014·0 cites·11 claims
- 2053US2014084413A1Package substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2148US2012178212A1Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2012·Application pending·0 cites
- 2247US8536613B2Heterostructure containing IC and LED and method for fabricating the sameCHEN KUAN-NENG·Filed 2011·Granted Sep 17, 2013·0 cites·10 claims
- 2344US11355472B2Package structure and method for connecting componentsIND TECH RES INST·Filed 2019·Granted Jun 7, 2022·0 cites·3 claims
- 2444US8039935B2Wafer level chip scale packaging structure and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Oct 18, 2011·0 cites·7 claims
- 2542US2014117557A1Package substrate and method of forming the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2639US9931813B2Bonding structure and method of fabricating the sameCHEN KUAN NENG·Filed 2010·Granted Apr 3, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →