Inventor · disambiguated record
Wen-Hsiung Lu
Also filed as: LU WEN-HSIUNG
115 granted patents·19 pending applications·765 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD89TAIWAN SEMICONDUCTOR MFG19LU WEN-HSIUNG8CHEN MENG-TSE4LIN CHIH-WEI4
Top patents by PatentIndex Score
134 records- 0198US9263839B2System and method for an improved fine pitch jointTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·69 cites·17 claims
- 0298US9257333B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·77 cites·20 claims
- 0398US9196559B2Directly sawing wafers covered with liquid molding compoundTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·61 cites·19 claims
- 0498US8987922B2Methods and apparatus for wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 24, 2015·65 cites·20 claims
- 0597US9196532B2Integrated circuit packages and methods for forming the sameTU CHIA-WEI·Filed 2012·Granted Nov 24, 2015·67 cites·20 claims
- 0697US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0796US11854835B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0896US8975741B2Process for forming package-on-package structuresLIN CHIH-WEI·Filed 2011·Granted Mar 10, 2015·21 cites·20 claims
- 0996US8492891B2Cu pillar bump with electrolytic metal sidewall protectionLU WEN-HSIUNG·Filed 2010·Granted Jul 23, 2013·43 cites·20 claims
- 1095US11101233B1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 24, 2021·4 cites·20 claims
- 1195US8823166B2Pillar bumps and process for making sameLIN CHENG-CHUNG·Filed 2010·Granted Sep 2, 2014·25 cites·10 claims
- 1295US8735273B2Forming wafer-level chip scale package structures with reduced number of seed layersLU WEN-HSIUNG·Filed 2011·Granted May 27, 2014·25 cites·20 claims
- 1395US8659155B2Mechanisms for forming copper pillar bumpsCHENG MING-DA·Filed 2010·Granted Feb 25, 2014·33 cites·25 claims
- 1495US8405199B2Conductive pillar for semiconductor substrate and method of manufactureLU WEN-HSIUNG·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 1594US11776881B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 1692US9666572B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·6 cites·20 claims
- 1792US9559005B2Methods of packaging and dicing semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 31, 2017·14 cites·20 claims
- 1891US9059109B2Package assembly and method of forming the sameLIN HUNG-JEN·Filed 2012·Granted Jun 16, 2015·15 cites·20 claims
- 1991US8242011B2Method of forming metal pillarLIM ZHENG-YI·Filed 2011·Granted Aug 14, 2012·23 cites·20 claims
- 2089US11075173B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 2189US9437564B2Interconnect structure and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·11 cites·21 claims
- 2289US9117816B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Aug 25, 2015·5 cites·20 claims
- 2388US8581401B2Mechanisms for forming copper pillar bumps using patterned anodesLU WEN-HSIUNG·Filed 2012·Granted Nov 12, 2013·8 cites·20 claims
- 2486US11289404B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·2 cites·20 claims
- 2586US10056312B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·19 claims
- 2686US9607921B2Package on package interconnect structureLU WEN-HSIUNG·Filed 2012·Granted Mar 28, 2017·8 cites·17 claims
- 2786US9082776B2Semiconductor package having protective layer with curved surface and method of manufacturing sameLU WEN-HSIUNG·Filed 2012·Granted Jul 14, 2015·7 cites·18 claims
- 2885US12300580B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 2985US9598772B2Method for fabricating bump structure without UBM undercutLIN CHIH-WEI·Filed 2010·Granted Mar 21, 2017·8 cites·20 claims
- 3085US9006097B2Cu pillar bump with electrolytic metal sidewall protectionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·6 cites·19 claims
- 3185US2025357145A1Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3284US12438048B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 3384US9355906B2Packaging devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 31, 2016·4 cites·16 claims
- 3484US8603860B2Process for forming packagesCHEN MENG-TSE·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
- 3584US8546254B2Mechanisms for forming copper pillar bumps using patterned anodesLU WEN-HSIUNG·Filed 2010·Granted Oct 1, 2013·6 cites·20 claims
- 3684US2025349780A1Redistribution lines having nano columns and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3783US12494379B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 3883US9312214B2Semiconductor packages having polymer-containing substrates and methods of forming sameCHEN MENG-TSE·Filed 2011·Granted Apr 12, 2016·7 cites·20 claims
- 3983US9269658B2Ball amount process in the manufacturing of integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·5 cites·20 claims
- 4082US12431365B2Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 4182US9449931B2Pillar bumps and process for making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·4 cites·20 claims
- 4282US9412717B2Apparatus and methods for molded underfills in flip chip packagingCHEN MENG-TSE·Filed 2011·Granted Aug 9, 2016·6 cites·20 claims
- 4382US9287203B2Package-on-package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·6 cites·20 claims
- 4482US2025266323A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4581US12040256B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 4681US11387143B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 4781US10079213B2Packaging devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 18, 2018·2 cites·20 claims
- 4881US9780009B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·2 cites·20 claims
- 4981US9396973B2Methods and apparatus for wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·3 cites·21 claims
- 5081US9385040B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·5 cites·20 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →