Inventor · disambiguated record

Wen-Hsin Wei

Also filed as: WEI WEN · WEI WEN-HSIN

42 granted patents·12 pending applications·774 citations·filing 2006–2025

98Inventor score

Technology areasH10W H04W G06F H10P H04L

Files withTAIWAN SEMICONDUCTOR MFG CO LTD40 INST INFORMATION INDUSTRY3 JUNIPER NETWORKS INC3 TAIWAN SEMICONDUCTOR MFG2 ALCATEL LUCENT1

Top patents by PatentIndex Score

54 records

0199US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
0299US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
0399US9818720B2Structure and formation method for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·53 cites·20 claims
0499US9806058B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·60 cites·20 claims
0599US8802504B13D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·408 cites·20 claims
0698US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
0798US10163856B2Stacked integrated circuit structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·22 cites·19 claims
0897US11456287B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·5 cites·20 claims
0997US10319699B2Chip package having die structures of different heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·21 cites·20 claims
1096US11810833B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
1196US10535633B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·14 cites·20 claims
1295US11062971B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·12 cites·20 claims
1395US9048231B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 2, 2015·13 cites·20 claims
1494US11923310B2Package structure including through via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
1593US10770365B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·6 cites·20 claims
1692US11967546B2Giga interposer integration through Chip-On-Wafer-On-SubstrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·1 cites·20 claims
1792US10529679B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 7, 2020·6 cites·20 claims
1888US11101260B2Method of forming a dummy die of an integrated circuit having an embedded annular structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·4 cites·20 claims
1987US11088079B2Package structure having line connected via portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·20 claims
2087US7930516B1Linked list traversal with reduced memory accessesJUNIPER NETWORKS INC·Filed 2009·Granted Apr 19, 2011·16 cites·17 claims
2187US2025054879A1Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2285US12294002B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 6, 2025·0 cites·20 claims
2385US9741669B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·3 cites·20 claims
2484US7600094B1Linked list traversal with reduced memory accessesJUNIPER NETWORKS INC·Filed 2006·Granted Oct 6, 2009·13 cites·17 claims
2581US2024222242A1Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2681US2025233119A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2780US11069657B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·1 cites·20 claims
2879US12021006B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
2978US12148719B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
3077US11183399B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·2 cites·20 claims
3177US10964667B2Stacked integrated circuit structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
3276US2022246581A1Stacked Integrated Circuit Structure and Method of FormingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
3373US12015023B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
3473US2024371794A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3572US2021242173A1Stacked Integrated Circuit Structure and Method of FormingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
3671US10163853B2Formation method of chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·20 claims
3769US11101140B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·1 cites·20 claims
3868US10854567B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
3965US11444038B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
4062US10985137B2Stacked integrated circuit structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
4161US12094836B2Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 17, 2024·0 cites·20 claims
4258US10515906B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
4356US2024088093A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4455US8001524B1Instruction extension for linked list lookupJUNIPER NETWORKS INC·Filed 2006·Granted Aug 16, 2011·1 cites·11 claims
4554US11527454B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
4654US8059604B2System and method of measuring heterogeneous network mobile communication apparatus and recording medium thereofSU CHIH-WEI·Filed 2007·Granted Nov 15, 2011·2 cites·33 claims
4747US11520930B2Privacy protection for third party data sharingALCATEL LUCENT·Filed 2014·Granted Dec 6, 2022·0 cites·1 claims
4845US11888700B2Method and apparatus for fine-grained isolation in CN NSS domain of E2E network sliceNOKIA SOLUTIONS & NETWORKS OY·Filed 2020·Granted Jan 30, 2024·0 cites·8 claims
4945US11877147B2Methods, device and computer-readable medium for protecting MAC addressesNOKIA TECHNOLOGIES OY·Filed 2018·Granted Jan 16, 2024·0 cites·16 claims
5045US2012136749A1Digital rights management (drm) method and apparatus in small and medium enterprise (sme) and method for providing drm serviceHU ZHIYUAN·Filed 2009·Application pending·0 cites

Showing the top 50 of 54 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →