Inventor · disambiguated record
Weng-Jin Wu
Also filed as: WU WENG-JIN
85 granted patents·15 pending applications·1,004 citations·filing 2000–2024
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG28SEMICONDUCTOR COMPONENTS IND LLC23TAIWAN SEMICONDUCTOR MFG CO LTD10WU WENG-JIN9CHIOU WEN-CHIH6
Top patents by PatentIndex Score
100 records- 0199US8669174B2Multi-die stacking using bumps with different sizesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 11, 2014·139 cites·20 claims
- 0299US7385283B2Three dimensional integrated circuit and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jun 10, 2008·279 cites·22 claims
- 0396US8053900B2Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effectTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 8, 2011·42 cites·12 claims
- 0496US7939941B2Formation of through via before contact processingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 10, 2011·36 cites·13 claims
- 0595US8264077B2Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chipsCHIOU WEN-CHIH·Filed 2008·Granted Sep 11, 2012·36 cites·16 claims
- 0694US10418396B1Stacked image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Sep 17, 2019·8 cites·8 claims
- 0794US8581418B2Multi-die stacking using bumps with different sizesWU WENG-JIN·Filed 2010·Granted Nov 12, 2013·17 cites·20 claims
- 0894US8119500B2Wafer bondingYANG KU-FENG·Filed 2007·Granted Feb 21, 2012·29 cites·18 claims
- 0994US8053277B2Three-dimensional integrated circuits with protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·27 cites·19 claims
- 1092US11289522B2Controllable gap height for an image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 29, 2022·3 cites·21 claims
- 1192US10868061B2Packaging structure for a sensor having a sealing layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 15, 2020·3 cites·17 claims
- 1291US8691664B2Backside process for a substrateYANG KU-FENG·Filed 2010·Granted Apr 8, 2014·14 cites·20 claims
- 1391US7955895B2Structure and method for stacked wafer fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jun 7, 2011·21 cites·10 claims
- 1491US7466028B1Semiconductor contact structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 16, 2008·23 cites·20 claims
- 1590US9960197B1Molded image sensor chip scale packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted May 1, 2018·5 cites·19 claims
- 1689US9209157B2Formation of through via before contact processingCHIOU WEN-CHIH·Filed 2011·Granted Dec 8, 2015·8 cites·18 claims
- 1789US8896136B2Alignment mark and method of formationTSAI CHEN-YU·Filed 2010·Granted Nov 25, 2014·10 cites·26 claims
- 1889US8629042B2Method for stacking semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 14, 2014·7 cites·20 claims
- 1989US8252665B2Protection layer for adhesive material at wafer edgeCHIOU WEN-CHIH·Filed 2010·Granted Aug 28, 2012·8 cites·20 claims
- 2089US7897481B2High throughput die-to-wafer bonding using pre-alignmentTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Mar 1, 2011·17 cites·10 claims
- 2189US7812459B2Three-dimensional integrated circuits with protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 12, 2010·21 cites·12 claims
- 2288US8853830B2System, structure, and method of manufacturing a semiconductor substrate stackCHANG HUNG-PIN·Filed 2008·Granted Oct 7, 2014·12 cites·30 claims
- 2388US8441136B2Protection layer for adhesive material at wafer edgeCHIOU WEN-CHIH·Filed 2012·Granted May 14, 2013·7 cites·14 claims
- 2488US8344513B2Barrier for through-silicon viaTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jan 1, 2013·12 cites·16 claims
- 2588US7872357B2Protection for bonding pads and methods of formationTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jan 18, 2011·16 cites·18 claims
- 2687US9418961B2Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·8 cites·18 claims
- 2787US9299612B2Stacked structures and methods of forming stacked structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 29, 2016·7 cites·20 claims
- 2887US9293418B2Backside through vias in a bonded structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·7 cites·20 claims
- 2986US10707250B2Embedded image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jul 7, 2020·1 cites·12 claims
- 3086US10290672B2Image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 14, 2019·5 cites·4 claims
- 3186US7989318B2Method for stacking semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 2, 2011·10 cites·20 claims
- 3285US6511235B2Integrated surface-emitting optoelectronic module and the method for making the sameIND TECH RES INST·Filed 2000·Granted Jan 28, 2003·37 cites·12 claims
- 3384US8405225B2Three-dimensional integrated circuits with protection layersYU CHEN-HUA·Filed 2012·Granted Mar 26, 2013·9 cites·20 claims
- 3483US10903255B2Image sensor flip chip packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 26, 2021·1 cites·20 claims
- 3583US8486823B2Methods of forming through viaCHIOU WEN-CHIH·Filed 2008·Granted Jul 16, 2013·10 cites·9 claims
- 3682US8680682B2Barrier for through-silicon viaTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 25, 2014·4 cites·20 claims
- 3782US8500182B2Vacuum wafer carriers for strengthening thin wafersYANG KU-FENG·Filed 2010·Granted Aug 6, 2013·5 cites·15 claims
- 3881US8736039B2Stacked structures and methods of forming stacked structuresWU WENG-JIN·Filed 2006·Granted May 27, 2014·9 cites·17 claims
- 3981US8252682B2Method for thinning a waferYANG KU-FENG·Filed 2010·Granted Aug 28, 2012·8 cites·27 claims
- 4080US10515933B2System, structure, and method of manufacturing a semiconductor substrate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·2 cites·20 claims
- 4180US10128289B2Embedded image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Nov 13, 2018·2 cites·20 claims
- 4280US7951647B2Performing die-to-wafer stacking by filling gaps between diesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted May 31, 2011·9 cites·20 claims
- 4379US9478480B2Alignment mark and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 25, 2016·3 cites·20 claims
- 4479US8232140B2Method for ultra thin wafer handling and processingYANG KU-FENG·Filed 2010·Granted Jul 31, 2012·4 cites·15 claims
- 4579US8058150B2Particle free wafer separationWU WENG-JIN·Filed 2008·Granted Nov 15, 2011·6 cites·20 claims
- 4678US9515108B2Image sensors with contamination barrier structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Dec 6, 2016·3 cites·15 claims
- 4778US9287166B2Barrier for through-silicon viaTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·3 cites·13 claims
- 4877US10615202B2Embedded image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 7, 2020·1 cites·13 claims
- 4977US9418876B2Method of three dimensional integrated circuit assemblyLIN JING-CHENG·Filed 2011·Granted Aug 16, 2016·4 cites·21 claims
- 5077US8362593B2Method for stacking semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Jan 29, 2013·3 cites·20 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →