Inventor · disambiguated record
Wei Yen
Also filed as: YEN WEI · YEN WEI HSIUNG
1 granted patent·5 pending applications·17 citations·filing 1986–2024
37Inventor score
Top patents by PatentIndex Score
6 records- 0174US2025174539A13d integrated circuit package and substrate structure thereofND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 0272US2024047298A1Semiconductor structureND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 0372US2024047192A1Manufacturing method of diamond composite waferND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 0457US2024234354A1Semiconductor package and method for manufacturing the sameND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 0551US2023317443A1Composite semiconductor wafer/chip for advanced ics and advanced ic packages and the manufacture method thereofND HI TECH LAB INC·Filed 2022·Application pending·0 cites
- 0639US4711350AInspectable antistatic container for packing electrical or electronic devicesYEN WEI HSIUNG·Filed 1986·Granted Dec 8, 1987·17 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →