Inventor · disambiguated record
William Crew
Also filed as: CREW JR WILLIAM WORTHINGTON · CREW WILLIAM · CREW WILLIAM W
11 granted patents·1 pending application·870 citations·filing 2003–2015
93Inventor score
Top patents by PatentIndex Score
12 records- 0198US7851232B2UV treatment for carbon-containing low-k dielectric repair in semiconductor processingNOVELLUS SYSTEMS INC·Filed 2006·Granted Dec 14, 2010·571 cites·22 claims
- 0295US7420275B1Boron-doped SIC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2006·Granted Sep 2, 2008·39 cites·20 claims
- 0394US7573061B1Low-k SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Aug 11, 2009·24 cites·14 claims
- 0494US7163889B2Film for copper diffusion barrierNOVELLUS SYSTEMS INC·Filed 2005·Granted Jan 16, 2007·29 cites·14 claims
- 0592US7968436B1Low-K SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2009·Granted Jun 28, 2011·15 cites·24 claims
- 0692US7282438B1Low-k SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Oct 16, 2007·53 cites·8 claims
- 0791US9484251B1Contact integration for reduced interface and series contact resistanceLAM RES CORP·Filed 2015·Granted Nov 1, 2016·7 cites·18 claims
- 0891US7842604B1Low-k b-doped SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Nov 30, 2010·17 cites·21 claims
- 0989US7239017B1Low-k B-doped SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Jul 3, 2007·42 cites·7 claims
- 1087US6967405B1Film for copper diffusion barrierYU YONGSIK·Filed 2003·Granted Nov 22, 2005·41 cites·16 claims
- 1183US7041543B1Strained transistor architecture and methodNOVELLUS SYSTEMS INC·Filed 2004·Granted May 9, 2006·32 cites·17 claims
- 1245US2011045610A1Uv treatment for carbon-containing low-k dielectric repair in semiconductor processingVAN SCHRAVENDIJK BART·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →