Inventor · disambiguated record
William Howland
Also filed as: HOWLAND JR WILLIAM H · HOWLAND WILLIAM H
23 granted patents·2 pending applications·296 citations·filing 1997–2016
95Inventor score
Files withSOLID STATE MEASUREMENTS INC18KEITHLEY INSTRUMENTS1KLA TENCOR CORP1LEHIGHTON ELECTRONICS INC1US ENERGY1
Top patents by PatentIndex Score
25 records- 0195US7023231B2Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereofSOLID STATE MEASUREMENTS INC·Filed 2004·Granted Apr 4, 2006·112 cites·20 claims
- 0286US7230443B1Non-contact mobile charge measurement with leakage band-bending and dipole correctionKLA TENCOR CORP·Filed 2005·Granted Jun 12, 2007·14 cites·22 claims
- 0381US6842029B2Non-invasive electrical measurement of semiconductor wafersSOLID STATE MEASUREMENTS INC·Filed 2002·Granted Jan 11, 2005·30 cites·17 claims
- 0480US6771092B1Non-contact mobile charge measurement with leakage band-bending and dipole correctionFiled 2002·Granted Aug 3, 2004·21 cites·1 claims
- 0576US10241018B2Wear test apparatusUS ENERGY·Filed 2016·Granted Mar 26, 2019·1 cites·17 claims
- 0673US6632691B1Apparatus and method for determining doping concentration of a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2002·Granted Oct 14, 2003·15 cites·8 claims
- 0771US6741093B2Method of determining one or more properties of a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2002·Granted May 25, 2004·15 cites·19 claims
- 0870US6788076B2Apparatus for determining doping concentration of a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2003·Granted Sep 7, 2004·13 cites·8 claims
- 0968US6522158B1Non-contact mobile charge measurement with leakage band-bending and dipole correctionKEITHLEY INSTRUMENTS·Filed 1997·Granted Feb 18, 2003·25 cites·1 claims
- 1063US6937050B1Non-contact mobile charge measurement with leakage band-bending and dipole correctionFiled 2004·Granted Aug 30, 2005·10 cites·1 claims
- 1158US6972582B2Apparatus and method for measuring semiconductor wafer electrical propertiesSOLID STATE MEASUREMENTS INC·Filed 2003·Granted Dec 6, 2005·8 cites·16 claims
- 1257US6836139B2Method and apparatus for determining defect and impurity concentration in semiconducting material of a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2002·Granted Dec 28, 2004·8 cites·20 claims
- 1356US2016313388A1Noncontact sensing of maximum open-circuit voltagesLEHIGHTON ELECTRONICS INC·Filed 2014·Application pending·0 cites
- 1455US6657454B2High speed threshold voltage and average surface doping measurementsSOLID STATE MEASUREMENTS INC·Filed 2002·Granted Dec 2, 2003·7 cites·3 claims
- 1551US7250313B2Method of detecting un-annealed ion implantsSOLID STATE MEASUREMENTS INC·Filed 2004·Granted Jul 31, 2007·3 cites·21 claims
- 1649US6803780B2Sample chuck with compound constructionSOLID STATE MEASUREMENTS INC·Filed 2002·Granted Oct 12, 2004·2 cites·9 claims
- 1747US6894519B2Apparatus and method for determining electrical properties of a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2002·Granted May 17, 2005·4 cites·26 claims
- 1846US7005307B2Apparatus and method for detecting soft breakdown of a dielectric layer of a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2004·Granted Feb 28, 2006·3 cites·18 claims
- 1944US7063992B2Semiconductor substrate surface preparation using high temperature convection heatingSOLID STATE MEASUREMENTS INC·Filed 2003·Granted Jun 20, 2006·1 cites·11 claims
- 2040US7007408B2Method and apparatus for removing and/or preventing surface contamination of a probeSOLID STATE MEASUREMENTS INC·Filed 2004·Granted Mar 7, 2006·2 cites·29 claims
- 2139US7282941B2Method of measuring semiconductor wafers with an oxide enhanced probeSOLID STATE MEASUREMENTS INC·Filed 2005·Granted Oct 16, 2007·0 cites·14 claims
- 2235US7304490B2In-situ wafer and probe desorption using closed loop heatingSOLID STATE MEASUREMENTS INC·Filed 2004·Granted Dec 4, 2007·1 cites·19 claims
- 2335US7190186B2Method and apparatus for determining concentration of defects and/or impurities in a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2004·Granted Mar 13, 2007·1 cites·19 claims
- 2433US2004108869A1Method of detecting carrier dose of a semiconductor waferFiled 2002·Application pending·0 cites
- 2526US7026837B2Method and apparatus for determining the dielectric constant of a low permittivity dielectric on a semiconductor waferSOLID STATE MEASUREMENTS INC·Filed 2003·Granted Apr 11, 2006·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when William Howland files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →