Inventor · disambiguated record
William T. Pike
Also filed as: PIKE WILLIAM T · PIKE WILLIAM THOMAS
10 granted patents·183 citations·filing 1988–2015
89Inventor score
Files withHEWLETT PACKARD CO3KINEMETRICS INC3CALIFORNIA INST OF TECHN2PIKE WILLIAM T1PIKE WILLIAM THOMAS1
Top patents by PatentIndex Score
10 records- 0179US6776042B2Micro-machined accelerometerKINEMETRICS INC·Filed 2002·Granted Aug 17, 2004·55 cites·16 claims
- 0279US5089782AVector network analyzer for swept frequency harmonic and mixer conversion loss measurements using either an internal or external signal sourceHEWLETT PACKARD CO·Filed 1990·Granted Feb 18, 1992·50 cites·20 claims
- 0374US6905945B1Microwave bonding of MEMS componentCALIFORNIA INST OF TECHN·Filed 2000·Granted Jun 14, 2005·21 cites·10 claims
- 0469US9869796B2Fabrication process and package design for use in a micro-machined seismometer or other deviceKINEMETRICS INC·Filed 2015·Granted Jan 16, 2018·1 cites·19 claims
- 0565US7870788B2Fabrication process and package design for use in a micro-machined seismometer or other deviceKINEMETRICS INC·Filed 2006·Granted Jan 18, 2011·4 cites·19 claims
- 0664US5332974ANetwork analyzer performance verificationHEWLETT PACKARD CO·Filed 1990·Granted Jul 26, 1994·30 cites·18 claims
- 0758US7036374B2Micro-machined suspension plate with integral proof mass for use in a seismometer or other devicePIKE WILLIAM THOMAS·Filed 2004·Granted May 2, 2006·11 cites·34 claims
- 0846US4949290AMethod and apparatus for defining test sequences for a signal measurement systemHEWLETT PACKARD CO·Filed 1988·Granted Aug 14, 1990·10 cites·14 claims
- 0944US6809305B2Microwave bonding of thin film metal coated substratesCALIFORNIA INST OF TECHN·Filed 2002·Granted Oct 26, 2004·1 cites·35 claims
- 1043US8978246B2Fabrication process and package design for use in a micro-machined seismometer or other devicePIKE WILLIAM T·Filed 2011·Granted Mar 17, 2015·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →