Inventor · disambiguated record
Wonjun Ko
Also filed as: KO WONJUN
17 granted patents·1 pending application·127 citations·filing 2007–2013
93Inventor score
Top patents by PatentIndex Score
18 records- 0196US8263435B2Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive viasCHOI DAESIK·Filed 2010·Granted Sep 11, 2012·47 cites·25 claims
- 0290US8536718B2Integrated circuit packaging system with trenches and method of manufacture thereofKO WONJUN·Filed 2010·Granted Sep 17, 2013·16 cites·28 claims
- 0383US9252032B2Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive viasCHOI DAESIK·Filed 2012·Granted Feb 2, 2016·6 cites·31 claims
- 0481US8609463B2Integrated circuit package system employing multi-package module techniquesKO WONJUN·Filed 2007·Granted Dec 17, 2013·11 cites·18 claims
- 0581US8227925B2Integrated circuit packaging system with interposerSONG SUNGMIN·Filed 2012·Granted Jul 24, 2012·5 cites·10 claims
- 0679US8035211B2Integrated circuit package system with support structure under wire-in-film adhesiveSTATS CHIPPAC LTD·Filed 2008·Granted Oct 11, 2011·12 cites·20 claims
- 0778US9076802B1Dual-sided film-assist molding processKO WONJUN·Filed 2013·Granted Jul 7, 2015·6 cites·18 claims
- 0877US8546957B2Integrated circuit packaging system with dielectric support and method of manufacture thereofKO WONJUN·Filed 2010·Granted Oct 1, 2013·5 cites·20 claims
- 0976US8569882B2Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereofKO WONJUN·Filed 2011·Granted Oct 29, 2013·5 cites·17 claims
- 1073US8524537B2Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residueYUN JAEUN·Filed 2010·Granted Sep 3, 2013·4 cites·28 claims
- 1172US10163744B2Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structureKIM OHHAN·Filed 2011·Granted Dec 25, 2018·3 cites·14 claims
- 1269US8124451B2Integrated circuit packaging system with interposerSONG SUNGMIN·Filed 2007·Granted Feb 28, 2012·4 cites·10 claims
- 1362US9279673B2Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpageSTATS CHIPPAC LTD·Filed 2013·Granted Mar 8, 2016·1 cites·25 claims
- 1458US8022538B2Base package system for integrated circuit package stacking and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Sep 20, 2011·1 cites·20 claims
- 1556US8618653B2Integrated circuit package system with wafer scale heat slugKO WONJUN·Filed 2008·Granted Dec 31, 2013·1 cites·20 claims
- 1646US2013256840A1Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape ResidueSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 1745US8415204B2Integrated circuit packaging system with heat spreader and method of manufacture thereofYUN JAEUN·Filed 2009·Granted Apr 9, 2013·0 cites·20 claims
- 1844US8067275B2Integrated circuit package system with package integrationKO WONJUN·Filed 2007·Granted Nov 29, 2011·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →