Inventor · disambiguated record
Woodong Lee
Also filed as: LEE WOODONG
2 granted patents·1 pending application·0 citations·filing 2012–2021
21Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0143US12230575B2Carrier structure including pockets for accommodating semiconductor chip stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 0242US12463105B2Semiconductor package including a dummy chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·13 claims
- 0329US2012315726A1Method of manufacturing a semiconductor chip packageBYUN HAK-KYOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →