Inventor · disambiguated record
Wolfgang Schober
Also filed as: SCHOBER WOLFGANG
42 granted patents·4 pending applications·298 citations·filing 2004–2019
98Inventor score
Files withINFINEON TECHNOLOGIES AG26KUKA DEUTSCHLAND GMBH10KUKA LAB GMBH5MAHLER JOACHIM3BAUER MICHAEL1
Top patents by PatentIndex Score
46 records- 0194US7749797B2Semiconductor device having a sensor chip, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 6, 2010·36 cites·23 claims
- 0292US7464603B2Sensor component with a cavity housing and a sensor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 16, 2008·26 cites·15 claims
- 0389US10836046B2Robot gripperKUKA DEUTSCHLAND GMBH·Filed 2016·Granted Nov 17, 2020·9 cites·17 claims
- 0487US9743995B2Robotic surgery system and surgical instrumentKUKA LAB GMBH·Filed 2014·Granted Aug 29, 2017·19 cites·17 claims
- 0586US7705436B2Semiconductor device with semiconductor chip and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 27, 2010·13 cites·37 claims
- 0685US7629660B2Semiconductor sensor component including a sensor chip and methods for the manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 8, 2009·14 cites·16 claims
- 0785US7462940B2Semiconductor component comprising flip chip contacts with polymer cores and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 9, 2008·13 cites·15 claims
- 0885US7443019B2Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 28, 2008·13 cites·13 claims
- 0984US10258421B2Surgical instrument, arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrumentKUKA DEUTSCHLAND GMBH·Filed 2014·Granted Apr 16, 2019·13 cites·17 claims
- 1083US10117715B2Surgical instrument arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrumentKUKA DEUTSCHLAND GMBH·Filed 2014·Granted Nov 6, 2018·10 cites·19 claims
- 1182US9993307B2Robotic surgery system and surgical instrumentKUKA LAB GMBH·Filed 2014·Granted Jun 12, 2018·10 cites·18 claims
- 1282US9782225B2Surgical instrument arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrumentKUKA LAB GMBH·Filed 2014·Granted Oct 10, 2017·10 cites·20 claims
- 1382US9536816B2Encapsulated electronic chip device with mounting provision and externally accessible electric connection structureINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 3, 2017·5 cites·19 claims
- 1481US10265869B2Robotic surgery systemKUKA DEUTSCHLAND GMBH·Filed 2014·Granted Apr 23, 2019·10 cites·18 claims
- 1578US7791177B2Electronic deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 7, 2010·12 cites·16 claims
- 1678US7768107B2Semiconductor component including semiconductor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 3, 2010·8 cites·13 claims
- 1776US8507080B2Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting materialMAHLER JOACHIM·Filed 2006·Granted Aug 13, 2013·7 cites·14 claims
- 1876US8017438B2Semiconductor module with at least two substratesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 13, 2011·7 cites·7 claims
- 1976US8013441B2Power semiconductor device in lead frame employing connecting element with conductive filmINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 6, 2011·7 cites·20 claims
- 2075US7230309B2Semiconductor component and sensor component for data transmission devicesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 12, 2007·23 cites·10 claims
- 2174US10130431B2Robotic surgery system and surgical instrumentKUKA LAB GMBH·Filed 2014·Granted Nov 20, 2018·4 cites·19 claims
- 2274US7834467B2Layer between interfaces of different components in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·6 cites·17 claims
- 2372US10384356B2Robotic surgery systemKUKA DEUTSCHLAND GMBH·Filed 2014·Granted Aug 20, 2019·4 cites·19 claims
- 2472US7589403B2Lead structure for a semiconductor component and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 15, 2009·5 cites·10 claims
- 2570US8178390B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2006·Granted May 15, 2012·3 cites·11 claims
- 2669US10390900B2Surgical instrument arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrumentKUKA DEUTSCHLAND GMBH·Filed 2014·Granted Aug 27, 2019·2 cites·12 claims
- 2766US7880300B2Semiconductor chip comprising a metal coating structure and associated production methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·3 cites·23 claims
- 2863US7540950B2Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layerINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 2, 2009·2 cites·9 claims
- 2961US7911039B2Component arrangement comprising a carrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·1 cites·16 claims
- 3059US10405933B2Robotic surgery system and surgical instrumentKUKA DEUTSCHLAND GMBH·Filed 2017·Granted Sep 10, 2019·0 cites·18 claims
- 3158US9859198B2Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 2, 2018·0 cites·5 claims
- 3258US7645642B2Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset compositeINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 12, 2010·1 cites·17 claims
- 3357US10128180B2Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·0 cites·13 claims
- 3456US12005577B2Robot assemblyKUKA DEUTSCHLAND GMBH·Filed 2019·Granted Jun 11, 2024·0 cites·14 claims
- 3555US10293498B2Surgical robot systemKUKA DEUTSCHLAND GMBH·Filed 2014·Granted May 21, 2019·0 cites·18 claims
- 3653US8440733B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2012·Granted May 14, 2013·0 cites·18 claims
- 3753US8147621B2Method for producing a metal article intended for at least partially coating with a substanceRIEDL EDMUND·Filed 2008·Granted Apr 3, 2012·0 cites·18 claims
- 3851US7384698B2Metal article intended for at least partially coating with a substance and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 10, 2008·2 cites·11 claims
- 3950US2014001622A1Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesBAUER MICHAEL·Filed 2012·Application pending·0 cites
- 4048US7714422B2Electronic module with a semiconductor chip and a component housing and methods for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 11, 2010·0 cites·11 claims
- 4148US2013105992A1Semiconductor component having a stack of semiconductor chips and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
- 4247US8354299B2Semiconductor component having a stack of semiconductor chips and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jan 15, 2013·0 cites·7 claims
- 4346US2016213434A1Robot Comprising A ToolKUKA LAB GMBH·Filed 2014·Application pending·0 cites
- 4444US7728053B2Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing compositionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 1, 2010·0 cites·14 claims
- 4541US10229891B2Chip embedding package with solderable electric contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 12, 2019·0 cites·22 claims
- 4640US2021023722A1Articulated arm robot joint arrangementKUKA DEUTSCHLAND GMBH·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →