Inventor · disambiguated record
Xiaolan Ba
Also filed as: BA XIAOLAN
11 granted patents·8 pending applications·88 citations·filing 2014–2024
88Inventor score
Top patents by PatentIndex Score
19 records- 0197US9613818B2Deposition of low fluorine tungsten by sequential CVD processLAM RES CORP·Filed 2015·Granted Apr 4, 2017·33 cites·12 claims
- 0296US9978605B2Method of forming low resistivity fluorine free tungsten film without nucleationLAM RES CORP·Filed 2017·Granted May 22, 2018·23 cites·23 claims
- 0394US9754824B2Tungsten films having low fluorine contentLAM RES CORP·Filed 2015·Granted Sep 5, 2017·15 cites·20 claims
- 0492US10546751B2Forming low resistivity fluorine free tungsten film without nucleationLAM RES CORP·Filed 2018·Granted Jan 28, 2020·8 cites·19 claims
- 0577US12014928B2Multi-layer feature fillLAM RES CORP·Filed 2019·Granted Jun 18, 2024·2 cites·17 claims
- 0676US9580801B2Enhancing electrical property and UV compatibility of ultrathin blok barrier filmAPPLIED MATERIALS INC·Filed 2014·Granted Feb 28, 2017·3 cites·19 claims
- 0774US2025132201A1Nucleation-free depositionLAM RES CORP·Filed 2024·Application pending·0 cites
- 0873US11972952B2Atomic layer deposition on 3D NAND structuresLAM RES CORP·Filed 2019·Granted Apr 30, 2024·1 cites·16 claims
- 0973US9633861B2Cu/barrier interface enhancementAPPLIED MATERIALS INC·Filed 2014·Granted Apr 25, 2017·3 cites·8 claims
- 1072US2024282580A1Multi-layer feature fillLAM RES CORP·Filed 2024·Application pending·0 cites
- 1171US2024266177A1Atomic layer deposition on 3d nand structuresLAM RES CORP·Filed 2024·Application pending·0 cites
- 1263US12237221B2Nucleation-free tungsten depositionLAM RES CORP·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 1355US2025391658A1Integrated high aspect ratio etchingLAM RES CORP·Filed 2023·Application pending·0 cites
- 1451US2025179637A1Showerhead for substrate processing systemsLAM RES CORP·Filed 2023·Application pending·0 cites
- 1548US12077858B2Tungsten depositionLAM RES CORP·Filed 2020·Granted Sep 3, 2024·0 cites·21 claims
- 1646US12060639B2Rapid flush purging during atomic layer depositionLAM RES CORP·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
- 1746US2024006180A1Low resistance pulsed cvd tungstenLAM RES CORP·Filed 2021·Application pending·0 cites
- 1843US2016013049A1Enhancing uv compatibility of low k barrier filmAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1941US2023260814A1Exclusion ring for substrate processingLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →