Inventor · disambiguated record
Xi Cen
Also filed as: CEN XI
13 granted patents·15 pending applications·3 citations·filing 2020–2024
83Inventor score
Files withAPPLIED MATERIALS INC28
Top patents by PatentIndex Score
28 records- 0180US11380536B2Multi-step pre-clean for selective metal gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Jul 5, 2022·1 cites·18 claims
- 0271US11680312B2Catalyst enhanced seamless ruthenium gap fillAPPLIED MATERIALS INC·Filed 2022·Granted Jun 20, 2023·0 cites·20 claims
- 0370US2025038051A1Tungsten molybdenum structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0466US11776806B2Multi-step pre-clean for selective metal gap fillAPPLIED MATERIALS INC·Filed 2022·Granted Oct 3, 2023·0 cites·17 claims
- 0566US11401602B2Catalyst enhanced seamless ruthenium gap fillAPPLIED MATERIALS INC·Filed 2021·Granted Aug 2, 2022·0 cites·20 claims
- 0666US2022325410A1Gap fill methods using catalyzed depositionAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0764US12159804B2Tungsten molybdenum structuresAPPLIED MATERIALS INC·Filed 2022·Granted Dec 3, 2024·0 cites·8 claims
- 0863US12094773B2Methods for low resistivity and stress tungsten gap fillAPPLIED MATERIALS INC·Filed 2022·Granted Sep 17, 2024·0 cites·8 claims
- 0962US12351909B2Gap fill methods using catalyzed depositionAPPLIED MATERIALS INC·Filed 2021·Granted Jul 8, 2025·0 cites·6 claims
- 1060USD1066440SProcess chamber pumping linerAPPLIED MATERIALS INC·Filed 2022·Granted Mar 11, 2025·2 cites·1 claims
- 1160US11798845B2Methods and apparatus for low resistivity and stress tungsten gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Oct 24, 2023·0 cites·13 claims
- 1258US12014956B2Tungsten gapfill using molybdenum co-flowAPPLIED MATERIALS INC·Filed 2021·Granted Jun 18, 2024·0 cites·12 claims
- 1358US2025210381A1Heat reflection assembly for substrate temperature uniformityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1457US2024282631A1Integration solution for nand deep contact gap fillAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1557US2025300015A1Selective tungsten nand deep contact gap bottom fillAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1656US2024266215A1Low stress tungsten layer depositionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1755US2024258109A1Method of depositing a tungsten containing layerAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1855US2024371654A1Silicon nitride damage-free dry etch method for tungsten removal in middle of line bottom-up tungsten integrationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1954US2024014072A1Nitrogen plasma treatment for bottom-up growthAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2052US11859277B2Catalyst enhanced molybdenum deposition and gap fillAPPLIED MATERIALS INC·Filed 2021·Granted Jan 2, 2024·0 cites·7 claims
- 2152US2024047268A1Methods for forming multi-tier tungsten featuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2251US11355391B2Method for forming a metal gapfillAPPLIED MATERIALS INC·Filed 2020·Granted Jun 7, 2022·0 cites·19 claims
- 2349US12191198B2Low resistivity tungsten film and method of manufactureAPPLIED MATERIALS INC·Filed 2020·Granted Jan 7, 2025·0 cites·16 claims
- 2449US2024162089A1Surface depassivation with thermal etch after nitrogen radical treatmentAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2549US2023317458A1Gap fill enhancement with thermal etchAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2649US2023023235A1Enhanced stress tuning and interfacial adhesion for tungsten (w) gap fillAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2748US2024209500A1Processing system and methods for forming void-free and seam-free tungsten featuresAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2847US2022359279A1Methods of forming void and seam free metal featuresAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →