Inventor · disambiguated record
Xinhai Han
Also filed as: HAN XINHAI
45 granted patents·22 pending applications·615 citations·filing 2010–2025
97Inventor score
Top patents by PatentIndex Score
67 records- 0197US11569257B2Multi-layer stacks for 3D NAND extendabilityAPPLIED MATERIALS INC·Filed 2020·Granted Jan 31, 2023·4 cites·19 claims
- 0297US9157730B2PECVD processAPPLIED MATERIALS INC·Filed 2013·Granted Oct 13, 2015·49 cites·18 claims
- 0396US9458537B2PECVD processAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·12 cites·20 claims
- 0496US8076250B1PECVD oxide-nitride and oxide-silicon stacks for 3D memory applicationRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Dec 13, 2011·488 cites·20 claims
- 0595US9816187B2PECVD processAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·8 cites·20 claims
- 0693US11613812B2PECVD processAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·2 cites·20 claims
- 0793US10700087B2Multi-layer stacks for 3D NAND extendibilityAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·8 cites·20 claims
- 0891US10276353B2Dual-channel showerhead for formation of film stacksAPPLIED MATERIALS INC·Filed 2016·Granted Apr 30, 2019·4 cites·20 claims
- 0990US10793954B2PECVD processAPPLIED MATERIALS INC·Filed 2018·Granted Oct 6, 2020·3 cites·13 claims
- 1090US10060032B2PECVD processAPPLIED MATERIALS INC·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 1189US11501993B2Semiconductor substrate supports with improved high temperature chuckingAPPLIED MATERIALS INC·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 1286US12110590B2Faceplate having a curved surfaceAPPLIED MATERIALS INC·Filed 2023·Granted Oct 8, 2024·0 cites·18 claims
- 1386US10246772B2Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2016·Granted Apr 2, 2019·5 cites·20 claims
- 1485US11898249B2PECVD processAPPLIED MATERIALS INC·Filed 2023·Granted Feb 13, 2024·0 cites·17 claims
- 1585US8563095B2Silicon nitride passivation layer for covering high aspect ratio featuresRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Oct 22, 2013·11 cites·35 claims
- 1683US11851759B2Faceplate having a curved surfaceAPPLIED MATERIALS INC·Filed 2022·Granted Dec 26, 2023·0 cites·16 claims
- 1783US11530482B2Faceplate having a curved surfaceAPPLIED MATERIALS INC·Filed 2020·Granted Dec 20, 2022·1 cites·20 claims
- 1880US11164882B23-D NAND control gate enhancementAPPLIED MATERIALS INC·Filed 2020·Granted Nov 2, 2021·1 cites·9 claims
- 1980US11056406B2Stack of multiple deposited semiconductor layersAPPLIED MATERIALS INC·Filed 2019·Granted Jul 6, 2021·2 cites·12 claims
- 2079US9490116B2Gate stack materials for semiconductor applications for lithographic overlay improvementAPPLIED MATERIALS INC·Filed 2015·Granted Nov 8, 2016·3 cites·20 claims
- 2177US11948846B2Analyzing in-plane distortionAPPLIED MATERIALS INC·Filed 2023·Granted Apr 2, 2024·0 cites·20 claims
- 2276US11339475B2Film stack overlay improvementAPPLIED MATERIALS INC·Filed 2019·Granted May 24, 2022·2 cites·17 claims
- 2376US2024243018A1Analyzing in-plane distortionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2473US10030306B2PECVD apparatus and processAPPLIED MATERIALS INC·Filed 2013·Granted Jul 24, 2018·1 cites·16 claims
- 2572US11365476B2Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2019·Granted Jun 21, 2022·1 cites·20 claims
- 2672US10490467B2Methods of forming a stack of multiple deposited semiconductor layersAPPLIED MATERIALS INC·Filed 2018·Granted Nov 26, 2019·1 cites·12 claims
- 2772US2025101578A1Modified stacks for 3d nandAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2872US2025264867A1Methods and mechanisms for adjusting film deposition parameters during substrate manufacturingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2971US12317493B2Methods of forming 3D NAND structures with decreased pitchAPPLIED MATERIALS INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 3069US12265379B2Methods and mechanisms for adjusting film deposition parameters during substrate manufacturingAPPLIED MATERIALS INC·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 3167US11637043B2Analyzing in-plane distortionAPPLIED MATERIALS INC·Filed 2020·Granted Apr 25, 2023·0 cites·15 claims
- 3267US10002745B2Plasma treatment process for in-situ chamber cleaning efficiency enhancement in plasma processing chamberAPPLIED MATERIALS INC·Filed 2016·Granted Jun 19, 2018·1 cites·17 claims
- 3366US10199388B2VNAND tensile thick TEOS oxideAPPLIED MATERIALS INC·Filed 2016·Granted Feb 5, 2019·1 cites·10 claims
- 3466US9972487B2Dielectric-metal stack for 3D flash memory applicationAPPLIED MATERIALS INC·Filed 2015·Granted May 15, 2018·1 cites·20 claims
- 3563US2025376761A1Method for forming high density carbon films with reduced substrate backside damageAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3663US2025257451A1High density amorphous carbon film with reduced hydrogen contentAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3762US11622489B23-D NAND control gate enhancementAPPLIED MATERIALS INC·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
- 3859US11515324B23D NAND structures with decreased pitchAPPLIED MATERIALS INC·Filed 2019·Granted Nov 29, 2022·0 cites·17 claims
- 3959US10553427B2Low dielectric constant oxide and low resistance OP stack for 3D NAND applicationAPPLIED MATERIALS INC·Filed 2018·Granted Feb 4, 2020·0 cites·7 claims
- 4058US11837448B2High-temperature chamber and chamber component cleaning and maintenance method and apparatusAPPLIED MATERIALS INC·Filed 2021·Granted Dec 5, 2023·0 cites·22 claims
- 4158US2024045399A1Analysis of multi-run cyclic processing proceduresAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4258US2020126784A1Low dielectric constant oxide and low resistance op stack for 3d nand applicationAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4358US2025357117A1Doped tungsten carbide low-k etch hard maskAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4457US12195846B2Modified stacks for 3D NANDAPPLIED MATERIALS INC·Filed 2020·Granted Jan 14, 2025·0 cites·12 claims
- 4557US2025391671A1Reaction chamber with multi phase precursor deliveryAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4657US2025116001A1Arc reduction and rf control for electrostatic chucks in semiconductor processingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4756US10475644B2Dielectric-metal stack for 3D flash memory applicationAPPLIED MATERIALS INC·Filed 2018·Granted Nov 12, 2019·0 cites·20 claims
- 4856US2024427979A1Substrate stress uniformity management based on overlay error measurementsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4956US2025379052A1Amorphous multi-metal-doped film for hardmask applicationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 5055US8298887B2High mobility monolithic p-i-n diodesHAN XINHAI·Filed 2010·Granted Oct 30, 2012·1 cites·18 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →