Inventor · disambiguated record
Xiao Li
Also filed as: LI XIAO · LI XIAO F · Li xiao-hua
66 granted patents·20 pending applications·133 citations·filing 2004–2025
98Inventor score
Files withMICRON TECHNOLOGY INC55LODESTAR LICENSING GROUP LLC3MAGIC LEAP INC3SNAP INC3UNIV SOUTHEAST3
Top patents by PatentIndex Score
86 records- 0196US12002759B2Apparatuses including a conductive contact including a dielectric material surrounded by a conductive materialLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0295US11982813B2Waveguides with high index materials and methods of fabrication thereofMAGIC LEAP INC·Filed 2020·Granted May 14, 2024·3 cites·19 claims
- 0393US9070656B2Underfill-accommodating heat spreaders and related semiconductor device assemblies and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 30, 2015·21 cites·20 claims
- 0492US9691746B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 27, 2017·9 cites·16 claims
- 0592US9153520B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsGROOTHUIS STEVEN K·Filed 2012·Granted Oct 6, 2015·17 cites·21 claims
- 0690US11978705B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2021·Granted May 7, 2024·2 cites·16 claims
- 0790US10916487B2Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 9, 2021·5 cites·23 claims
- 0889US10424531B2Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 24, 2019·5 cites·11 claims
- 0989US9337119B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated systemsMICRON TECHNOLOGY INC·Filed 2014·Granted May 10, 2016·10 cites·28 claims
- 1089US9269646B2Semiconductor die assemblies with enhanced thermal management and semiconductor devices including sameLUO SHIJIAN·Filed 2012·Granted Feb 23, 2016·12 cites·28 claims
- 1188US11715685B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 1, 2023·2 cites·17 claims
- 1288US9960150B2Semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2016·Granted May 1, 2018·5 cites·18 claims
- 1388US2025336826A1Microelectronic devces and memory devicesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 1487US11398146B2Emergency assistance responseMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 26, 2022·3 cites·17 claims
- 1587US11342265B2Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted May 24, 2022·3 cites·23 claims
- 1686US12368101B2Apparatuses including interconnect structures including dielectric material surrounded by conductive material, and related memory devicesLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1784US10548230B2Method for stress reduction in semiconductor package via carrierMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 28, 2020·3 cites·18 claims
- 1884US2025056802A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1983US10916527B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 9, 2021·1 cites·19 claims
- 2083US10170389B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 1, 2019·3 cites·16 claims
- 2182US12498578B2Waveguides with high index materials and methods of fabrication thereofMAGIC LEAP INC·Filed 2024·Granted Dec 16, 2025·0 cites·17 claims
- 2282US10952333B2Method for stress reduction in semiconductor package via carrierMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 2382US10163693B1Methods for processing semiconductor dice and fabricating assemblies incorporating sameMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·3 cites·20 claims
- 2481US12167604B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Dec 10, 2024·0 cites·19 claims
- 2581US10861765B2Carrier removal by use of multilayer foilMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 2681US2023395463A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2778US10541229B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 21, 2020·2 cites·24 claims
- 2877US12468439B1Hand scale factor estimation from mobile interactionsSNAP INC·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 2977US12250812B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 3077US2025261367A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3176US11445170B2Eyeball camera system and methods for display system calibrationMAGIC LEAP INC·Filed 2020·Granted Sep 13, 2022·1 cites·24 claims
- 3276US2025006324A1Systems for generating personalized and/or local weather forecastsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3375US11163540B2Application program for extension and deployment of integrated and exportable cross platform digital twin modelANSYS INC·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 3475US10741468B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 11, 2020·1 cites·11 claims
- 3575US10074633B2Semiconductor die assemblies having molded underfill structures and related technologyMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 11, 2018·2 cites·22 claims
- 3674US12456685B2Microelectronic devices comprising a boron-containing material, and related electronic systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 3774US11782581B2Display control method and device, electronic device and storage mediumNETEASE HANGZHOU NETWORK CO LTD·Filed 2020·Granted Oct 10, 2023·2 cites·20 claims
- 3874US11776877B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 3973US10163755B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·1 cites·5 claims
- 4073US2025194088A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4173US2024250033A1Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4271US11594462B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 28, 2023·0 cites·15 claims
- 4370US11889691B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 30, 2024·0 cites·28 claims
- 4470US11688664B2Semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 27, 2023·0 cites·18 claims
- 4570US9443744B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 13, 2016·2 cites·26 claims
- 4670US9157014B2Adhesives including a filler material and related methodsMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 13, 2015·2 cites·27 claims
- 4767US12295140B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted May 6, 2025·0 cites·14 claims
- 4867US11600630B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 7, 2023·0 cites·19 claims
- 4967US10699716B2Artificial intelligence-based method and device for voiceprint authenticationBaidu online network technology beijing co ltd·Filed 2016·Granted Jun 30, 2020·2 cites·17 claims
- 5067US8492242B2Dry flux bonding device and methodFAY OWEN·Filed 2010·Granted Jul 23, 2013·3 cites·22 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →