Inventor · disambiguated record
Xiaojin Wei
Also filed as: WEI XIAOJIN
36 granted patents·3 pending applications·435 citations·filing 2005–2025
97Inventor score
Top patents by PatentIndex Score
39 records- 0198US9560737B2Electronic package with heat transfer element(s)IBM·Filed 2015·Granted Jan 31, 2017·34 cites·18 claims
- 0297US9504184B2Flexible coolant manifold-heat sink assemblyIBM·Filed 2015·Granted Nov 22, 2016·21 cites·17 claims
- 0397US8299608B2Enhanced thermal management of 3-D stacked die packagingBARTLEY GERALD K·Filed 2010·Granted Oct 30, 2012·60 cites·23 claims
- 0497US7928562B2Segmentation of a die stack for 3D packaging thermal managementIBM·Filed 2008·Granted Apr 19, 2011·58 cites·18 claims
- 0596US9913403B2Flexible coolant manifold—heat sink assemblyIBM·Filed 2016·Granted Mar 6, 2018·20 cites·15 claims
- 0695US7893529B2Thermoelectric 3D coolingIBM·Filed 2009·Granted Feb 22, 2011·34 cites·12 claims
- 0795US7414843B2Method and apparatus for a layered thermal management arrangementINTEL CORP·Filed 2005·Granted Aug 19, 2008·58 cites·18 claims
- 0894US9980410B1Heat pipe and vapor chamber heat dissipationIBM·Filed 2017·Granted May 22, 2018·8 cites·1 claims
- 0993US8115303B2Semiconductor package structures having liquid coolers integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2008·Granted Feb 14, 2012·28 cites·11 claims
- 1092US9894807B2Changeable, airflow venting cover assembly for an electronics rackIBM·Filed 2015·Granted Feb 13, 2018·11 cites·10 claims
- 1192US8030113B2Thermoelectric 3D coolingIBM·Filed 2011·Granted Oct 4, 2011·12 cites·6 claims
- 1291US10045464B1Heat pipe and vapor chamber heat dissipationIBM·Filed 2017·Granted Aug 7, 2018·6 cites·15 claims
- 1391US8772927B2Semiconductor package structures having liquid cooler integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2011·Granted Jul 8, 2014·12 cites·10 claims
- 1490US7812438B2Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packagingIBM·Filed 2008·Granted Oct 12, 2010·21 cites·11 claims
- 1587US8053284B2Method and package for circuit chip packagingIBM·Filed 2009·Granted Nov 8, 2011·15 cites·12 claims
- 1685US10237964B2Manufacturing electronic package with heat transfer element(s)IBM·Filed 2015·Granted Mar 19, 2019·4 cites·10 claims
- 1784US8455998B2Method and package for circuit chip packagingIRUVANTI SUSHUMNA·Filed 2011·Granted Jun 4, 2013·8 cites·13 claims
- 1883US10374263B2Cooled containment compartments for packaged battery cellsIBM·Filed 2017·Granted Aug 6, 2019·1 cites·18 claims
- 1982US8274301B2On-chip accelerated failure indicatorFENG KAI D·Filed 2009·Granted Sep 25, 2012·11 cites·20 claims
- 2078US9501069B2Control of solid state memory device temperature using queue depth managementIBM·Filed 2014·Granted Nov 22, 2016·4 cites·17 claims
- 2177US9619166B2Control of solid state memory device temperature using queue depth managementIBM·Filed 2016·Granted Apr 11, 2017·2 cites·1 claims
- 2275US10903534B2Battery pack capacity optimization via self-regulation of cell temperatureIBM·Filed 2018·Granted Jan 26, 2021·2 cites·20 claims
- 2375US10797359B2Cooled containment compartments for packaged battery cellsIBM·Filed 2019·Granted Oct 6, 2020·0 cites·18 claims
- 2471US2025076940A1Modular Liquid Cooling Architecture For Liquid CoolingGOOGLE LLC·Filed 2024·Application pending·0 cites
- 2568US11967538B2Three dimensional IC package with thermal enhancementGOOGLE LLC·Filed 2021·Granted Apr 23, 2024·0 cites·17 claims
- 2668US10374264B2Cooled containment compartments for packaged battery cellsIBM·Filed 2017·Granted Aug 6, 2019·0 cites·18 claims
- 2765US12174676B2Modular liquid cooling architecture for liquid coolingGOOGLE LLC·Filed 2021·Granted Dec 24, 2024·0 cites·14 claims
- 2864US10966351B2Heat pipe and vapor chamber heat dissipationELPIS TECH INC·Filed 2019·Granted Mar 30, 2021·0 cites·17 claims
- 2964US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 3063US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 3163US7759789B2Local area semiconductor cooling systemIBM·Filed 2008·Granted Jul 20, 2010·2 cites·20 claims
- 3262US10575440B2Heat pipe and vapor chamber heat dissipationIBM·Filed 2018·Granted Feb 25, 2020·0 cites·3 claims
- 3355US11955406B2Temperature control element utilized in device die packagesGOOGLE LLC·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 3453US9639105B2Thermal management in a multi-phase power systemIBM·Filed 2014·Granted May 2, 2017·0 cites·12 claims
- 3553US9423804B2Control of solid state memory device temperature using queue depth managementIBM·Filed 2016·Granted Aug 23, 2016·0 cites·1 claims
- 3650US9606562B2Thermal management in a multi-phase power systemIBM·Filed 2015·Granted Mar 28, 2017·0 cites·6 claims
- 3747US11081738B2Containment heatsink for packaged battery cellsIBM·Filed 2018·Granted Aug 3, 2021·0 cites·13 claims
- 3845US2019280354A1Blast tubing for packaging battery cellsIBM·Filed 2018·Application pending·0 cites
- 3943US2025265220A1Multi-chip module package technology for advanced driver assistance system applicationRIVIAN IP HOLDINGS LLC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →