Inventor · disambiguated record
Xiaoye Zhao
Also filed as: ZHAO XIAOYE
23 granted patents·6 pending applications·1,435 citations·filing 1999–2023
97Inventor score
Files withAPPLIED MATERIALS INC24AQUASENSING INC1BERA KALLOL1CANAAN CREATIVE CO LTD1HGST Netherlands BV1
Top patents by PatentIndex Score
29 records- 0198US8231799B2Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zoneBERA KALLOL·Filed 2006·Granted Jul 31, 2012·557 cites·18 claims
- 0298US6586886B1Gas distribution plate electrode for a plasma reactorAPPLIED MATERIALS INC·Filed 2001·Granted Jul 1, 2003·115 cites·46 claims
- 0397US7575007B2Chamber recovery after opening barrier over copperAPPLIED MATERIALS INC·Filed 2006·Granted Aug 18, 2009·197 cites·19 claims
- 0496US7030335B2Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppressionAPPLIED MATERIALS INC·Filed 2001·Granted Apr 18, 2006·72 cites·125 claims
- 0596US6894245B2Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppressionAPPLIED MATERIALS INC·Filed 2001·Granted May 17, 2005·108 cites·31 claims
- 0691US7300597B2Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric materialAPPLIED MATERIALS INC·Filed 2006·Granted Nov 27, 2007·18 cites·23 claims
- 0790US8828248B2Method for defect reduction in magnetic write head fabricationHGST Netherlands BV·Filed 2013·Granted Sep 9, 2014·17 cites·20 claims
- 0890US7431859B2Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulationAPPLIED MATERIALS INC·Filed 2006·Granted Oct 7, 2008·18 cites·16 claims
- 0990US7132618B2MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppressionAPPLIED MATERIALS INC·Filed 2003·Granted Nov 7, 2006·43 cites·35 claims
- 1090US6921727B2Method for modifying dielectric characteristics of dielectric layersAPPLIED MATERIALS INC·Filed 2003·Granted Jul 26, 2005·61 cites·35 claims
- 1189US7540971B2Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas contentAPPLIED MATERIALS INC·Filed 2006·Granted Jun 2, 2009·16 cites·19 claims
- 1289US7186943B2MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppressionAPPLIED MATERIALS INC·Filed 2005·Granted Mar 6, 2007·12 cites·20 claims
- 1387US7541292B2Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zonesAPPLIED MATERIALS INC·Filed 2006·Granted Jun 2, 2009·12 cites·21 claims
- 1487US6677712B2Gas distribution plate electrode for a plasma receptorAPPLIED MATERIALS INC·Filed 2003·Granted Jan 13, 2004·22 cites·14 claims
- 1586US7435685B2Method of forming a low-K dual damascene interconnect structureAPPLIED MATERIALS INC·Filed 2006·Granted Oct 14, 2008·13 cites·18 claims
- 1685US7115517B2Method of fabricating a dual damascene interconnect structureAPPLIED MATERIALS INC·Filed 2003·Granted Oct 3, 2006·32 cites·21 claims
- 1780US7413990B2Method of fabricating a dual damascene interconnect structureAPPLIED MATERIALS INC·Filed 2006·Granted Aug 19, 2008·6 cites·23 claims
- 1880US7132369B2Method of forming a low-K dual damascene interconnect structureAPPLIED MATERIALS INC·Filed 2003·Granted Nov 7, 2006·27 cites·34 claims
- 1977US6153530APost-etch treatment of plasma-etched feature surfaces to prevent corrosionAPPLIED MATERIALS INC·Filed 1999·Granted Nov 28, 2000·58 cites·30 claims
- 2076US8048806B2Methods to avoid unstable plasma states during a process transitionAPPLIED MATERIALS INC·Filed 2006·Granted Nov 1, 2011·5 cites·13 claims
- 2172US7256134B2Selective etching of carbon-doped low-k dielectricsAPPLIED MATERIALS INC·Filed 2003·Granted Aug 14, 2007·16 cites·18 claims
- 2267US7309448B2Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric materialAPPLIED MATERIALS INC·Filed 2003·Granted Dec 18, 2007·10 cites·41 claims
- 2365US2024125725A1Apparatus, method, and system for detection of the isotopic composition of liquidsAQUASENSING INC·Filed 2023·Application pending·0 cites
- 2446US2010101729A1Process kit having reduced erosion sensitivityAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 2543US2007254483A1Plasma etch process using polymerizing etch gases and an inert diluent gas in independent gas injection zones to improve etch profile or etch rate uniformityAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2642US2007048882A1Method to reduce plasma-induced charging damageAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2740US2009191711A1Hardmask open process with enhanced cd space shrink and reductionRUI YING·Filed 2008·Application pending·0 cites
- 2836US2003228768A1Dielectric etching with reduced striationAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 2926USD1094318SCooling container for computing devicesCANAAN CREATIVE CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →