Inventor · disambiguated record
Xuan Lin
Also filed as: LIN XUAN · LIN XUAN-HUI
31 granted patents·5 pending applications·290 citations·filing 1997–2025
97Inventor score
Files withENTHONE13SHANTOU CHENGHAI YATE AUTO ACCESS FACTORY8UNIV MISSOURI3GLOBALFOUNDRIES INC2PANECCASIO JR VINCENT2
Top patents by PatentIndex Score
36 records- 0194US7670950B2Copper metallization of through silicon viaENTHONE·Filed 2008·Granted Mar 2, 2010·43 cites·21 claims
- 0294US7303992B2Copper electrodeposition in microelectronicsENTHONE·Filed 2005·Granted Dec 4, 2007·29 cites·28 claims
- 0391US8771495B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersENTHONE·Filed 2013·Granted Jul 8, 2014·8 cites·19 claims
- 0490US9040421B2Methods for fabricating integrated circuits with improved contact structuresGLOBALFOUNDRIES INC·Filed 2013·Granted May 26, 2015·8 cites·20 claims
- 0590US7998859B2Surface preparation process for damascene copper depositionENTHONE·Filed 2008·Granted Aug 16, 2011·16 cites·33 claims
- 0687USD1057139SFanSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2023·Granted Jan 7, 2025·9 cites·1 claims
- 0787US8388824B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersPANECCASIO JR VINCENT·Filed 2008·Granted Mar 5, 2013·12 cites·50 claims
- 0887US6818116B2Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloysUNIV MISSOURI·Filed 2002·Granted Nov 16, 2004·23 cites·29 claims
- 0986US7968455B2Copper deposition for filling features in manufacture of microelectronic devicesENTHONE·Filed 2007·Granted Jun 28, 2011·11 cites·16 claims
- 1084US9287213B2Integrated circuits with improved contact structuresGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 15, 2016·3 cites·20 claims
- 1182US5932083AElectrodeposition of cerium-based coatings for corrosion protection of aluminum alloysUNIV MISSOURI·Filed 1997·Granted Aug 3, 1999·47 cites·22 claims
- 1281US7316772B2Defect reduction in electrodeposited copper for semiconductor applicationsENTHONE·Filed 2002·Granted Jan 8, 2008·23 cites·21 claims
- 1381US7241371B2Additive-assisted, cerium-based, corrosion-resistant e-coatingCURATORS OF UNIVERSITY OF MISS·Filed 2001·Granted Jul 10, 2007·19 cites·11 claims
- 1478US8608933B2Copper electrodeposition in microelectronicsPANECCASIO JR VINCENT·Filed 2011·Granted Dec 17, 2013·3 cites·13 claims
- 1577US7815786B2Copper electrodeposition in microelectronicsENTHONE·Filed 2007·Granted Oct 19, 2010·6 cites·19 claims
- 1676USD1080836SFanSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2023·Granted Jun 24, 2025·4 cites·1 claims
- 1774US7048807B2Cerium-based spontaneous coating process for corrosion protection of aluminum alloysUNIV MISSOURI·Filed 2002·Granted May 23, 2006·15 cites·55 claims
- 1873US11859176B2Method for in vitro activation and/or expansion of immune cellsIND TECH RES INST·Filed 2018·Granted Jan 2, 2024·1 cites·16 claims
- 1972USD1028696SHookSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2023·Granted May 28, 2024·3 cites·1 claims
- 2070US9222188B2Defect reduction in electrodeposited copper for semiconductor applicationsCOMMANDER JOHN·Filed 2008·Granted Dec 29, 2015·3 cites·10 claims
- 2158US9613858B2Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelersENTHONE·Filed 2014·Granted Apr 4, 2017·0 cites·16 claims
- 2258US9493884B2Copper electrodeposition in microelectronicsENTHONE·Filed 2013·Granted Nov 15, 2016·0 cites·13 claims
- 2358US2024150713A1Method for Producing Human Chimeric Antigen Receptor T-Cell Population Enriched with Stem Cell-like Memory T-CellsPELL BIO MED TECH CO LTD·Filed 2023·Application pending·0 cites
- 2457US2025376708A1Method for mRNA CappingINST PROCESS ENG CAS·Filed 2025·Application pending·0 cites
- 2556USD1063915SCell phone standSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2023·Granted Feb 25, 2025·1 cites·1 claims
- 2656USRE49202ECopper electrodeposition in microelectronicsMACDERMID ENTHONE INC·Filed 2018·Granted Sep 6, 2022·0 cites·69 claims
- 2755US8002962B2Copper electrodeposition in microelectronicsENTHONE·Filed 2004·Granted Aug 23, 2011·3 cites·9 claims
- 2855US2017029972A1Copper Electrodeposition in MicroelectronicsENTHONE·Filed 2016·Application pending·0 cites
- 2950USD1107211SFanSHENZHEN CARTER TECH CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·1 claims
- 3050USD1107212SFanSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2024·Granted Dec 23, 2025·0 cites·1 claims
- 3148USD1101922SFanSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2024·Granted Nov 11, 2025·0 cites·1 claims
- 3247USD1092708SFanSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2023·Granted Sep 9, 2025·0 cites·1 claims
- 3347US2008236619A1Cobalt capping surface preparation in microelectronics manufactureENTHONE·Filed 2008·Application pending·0 cites
- 3441US2007178697A1Copper electrodeposition in microelectronicsENTHONE·Filed 2006·Application pending·0 cites
- 3540USD1080605SUniversal mountSHANTOU CHENGHAI YATE AUTO ACCESS FACTORY·Filed 2023·Granted Jun 24, 2025·0 cites·1 claims
- 3633US10221496B2Copper filling of through silicon viasRICHARDSON THOMAS B·Filed 2011·Granted Mar 5, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →