Inventor · disambiguated record
Xuyen Pham
Also filed as: PHAM XUYEN · PHAM XUYEN N · PHAM XUYEN NGOC
31 granted patents·8 pending applications·570 citations·filing 1996–2018
97Inventor score
Top patents by PatentIndex Score
39 records- 0192US6569004B1Polishing pad and method of manufactureLAM RES·Filed 1999·Granted May 27, 2003·69 cites·10 claims
- 0291US6475332B1Interlocking chemical mechanical polishing systemLAM RES CORP·Filed 2000·Granted Nov 5, 2002·44 cites·13 claims
- 0390US6939212B1Porous material air bearing platen for chemical mechanical planarizationLAM RES CORP·Filed 2001·Granted Sep 6, 2005·36 cites·21 claims
- 0487US7228645B2Multi-zone shower head for drying single semiconductor substratePHAM XUYEN NGOC·Filed 2005·Granted Jun 12, 2007·14 cites·8 claims
- 0583US6953750B1Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarizationLAM RES CORP·Filed 2002·Granted Oct 11, 2005·25 cites·4 claims
- 0683US6806100B1Molded end point detection window for chemical mechanical planarizationLAM RES CORP·Filed 2002·Granted Oct 19, 2004·23 cites·32 claims
- 0783US6755723B1Polishing head assemblyLAM RES CORP·Filed 2000·Granted Jun 29, 2004·24 cites·23 claims
- 0882US6447380B1Polishing apparatus and substrate retainer ring providing continuous slurry distributionLAM RES CORP·Filed 2000·Granted Sep 10, 2002·28 cites·19 claims
- 0981US6896586B2Method and apparatus for heating polishing padLAM RES CORP·Filed 2002·Granted May 24, 2005·26 cites·16 claims
- 1077US7226055B1Substrate holding and spinning assembly and methods for making the sameLAM RES CORP·Filed 2003·Granted Jun 5, 2007·20 cites·12 claims
- 1173US6896600B1Liquid dispense manifold for chemical-mechanical polisherLAM RES CORP·Filed 2002·Granted May 24, 2005·16 cites·11 claims
- 1272US6199927B1Robot blade for handling of semiconductor substratesAPPLIED MATERIALS INC·Filed 1999·Granted Mar 13, 2001·37 cites·30 claims
- 1368US6024393ARobot blade for handling of semiconductor substrateAPPLIED MATERIALS INC·Filed 1996·Granted Feb 15, 2000·33 cites·8 claims
- 1467US6949016B1Gimballed conditioning apparatusLAM RES CORP·Filed 2002·Granted Sep 27, 2005·11 cites·20 claims
- 1567US6182712B1Power filling apparatus and methods for their useINHALE THERAPEUTIC SYST·Filed 1998·Granted Feb 6, 2001·92 cites·40 claims
- 1666US6872128B1System, method and apparatus for applying liquid to a CMP polishing padLAM RES CORP·Filed 2003·Granted Mar 29, 2005·10 cites·23 claims
- 1765US6732017B2System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning systemLAM RES CORP·Filed 2002·Granted May 4, 2004·15 cites·20 claims
- 1863US8783305B2Powder filling apparatus and methods for their useNAYDO KYLE A·Filed 2011·Granted Jul 22, 2014·2 cites·10 claims
- 1962US6869339B2Polishing pad and method of manufactureLAM RES CORP·Filed 2003·Granted Mar 22, 2005·3 cites·20 claims
- 2062US6712670B2Method and apparatus for applying downward force on wafer during CMPLAM RES CORP·Filed 2001·Granted Mar 30, 2004·7 cites·10 claims
- 2160US10497591B2Load lock chamber and the cluster tool system using the samePIOTECH CO LTD·Filed 2016·Granted Dec 3, 2019·1 cites·9 claims
- 2260US7054719B2System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning systemLAM RES CORP·Filed 2004·Granted May 30, 2006·11 cites·24 claims
- 2359US6746313B1Polishing head assembly in an apparatus for chemical mechanical planarizationLAM RES CORP·Filed 2001·Granted Jun 8, 2004·7 cites·19 claims
- 2456US7040954B1Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishingLAM RES CORP·Filed 2004·Granted May 9, 2006·6 cites·21 claims
- 2551US2007084079A1Multi-zone shower head for drying single semiconductor substratePHAM XUYEN·Filed 2006·Application pending·0 cites
- 2649US6761626B2Air platen for leading edge and trailing edge controlLAM RES CORP·Filed 2001·Granted Jul 13, 2004·3 cites·11 claims
- 2745USRE42942EPowder filling apparatus and methods for their useSTOUT GORDON·Filed 2003·Granted Nov 22, 2011·4 cites·58 claims
- 2843US10410909B2Waffer pedestal and support structure thereofPIOTECH CO LTD·Filed 2018·Granted Sep 10, 2019·0 cites·9 claims
- 2943US2007256632A1Systems and methods for clamping semiconductor wafersPHAM XUYEN·Filed 2006·Application pending·0 cites
- 3043US2007246079A1Multi zone shower head for cleaning and drying wafer and method of cleaning and drying waferPHAM XUYEN·Filed 2006·Application pending·0 cites
- 3142US7040970B2Apparatus and method for distributing a polishing fluidLAM RES CORP·Filed 2004·Granted May 9, 2006·1 cites·1 claims
- 3241US7018276B2Air platen for leading edge and trailing edge controlLAM RES CORP·Filed 2004·Granted Mar 28, 2006·0 cites·15 claims
- 3341US6821195B1Carrier head having location optimized vacuum holesLAM RES CORP·Filed 2002·Granted Nov 23, 2004·2 cites·20 claims
- 3441US2006157095A1Systems and methods for spinning semiconductor wafersPHAM XUYEN N·Filed 2005·Application pending·0 cites
- 3540US2004161939A1Method and apparatus for applying downward force on wafer during CMPLAM RES CORP·Filed 2004·Application pending·0 cites
- 3637US2002185467A1Interlocking chemical mechanical polishing systemLAM RES CORP·Filed 2002·Application pending·0 cites
- 3735US2004162007A1Chemical mechanical polishing atomizing rinse systemPHAN KY·Filed 2003·Application pending·0 cites
- 3830US10643882B2Ceramic ring with a ladder structurePIOTECH CO LTD·Filed 2017·Granted May 5, 2020·0 cites·2 claims
- 3930US2002077053A1Flexible polishing pad having reduced surface stressFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →