Inventor · disambiguated record
Xun Xiang
Also filed as: Xiang xun
3 granted patents·8 pending applications·11 citations·filing 2018–2025
56Inventor score
Files withINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES9GLOBALFOUNDRIES INC1SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD1
Top patents by PatentIndex Score
11 records- 0192US10395926B1Multiple patterning with mandrel cuts formed using a block maskGLOBALFOUNDRIES INC·Filed 2018·Granted Aug 27, 2019·11 cites·20 claims
- 0256US2025157971A1Three-dimensional chip stack preparing method and three-dimensional chip stacking structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0356US2025192091A1Fan-out package structure and fan-out package methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0451US2024304556A1Chiplet-fine-interconnection-package structure and method of manufacturing the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0548US2024186254A1Carrier structure suitable for chiplet fine line and manufacturing method thereof, and fine line chiplet packaging structure and manufacturing method of the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0646US12184253B2Filter radio frequency module packaging structure and method for manufacturing sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Dec 31, 2024·0 cites·18 claims
- 0743US12112956B2Chip interconnection package structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 0843US2025336873A1Back-to-back three-dimensional stacked fan-out packaging structure and preparation method thereof, back-to-back three-dimensional stacked fan-out packaging module and preparation method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2025·Application pending·0 cites
- 0941US2025174565A1Embedded three-dimensional fan-out package structure and preparation method thereofSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
- 1041US2025300059A1Double-sided stacked fan-out package device and fabrication method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2025·Application pending·0 cites
- 1140US2022149007A1Chip packaging structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →