Inventor · disambiguated record
Y. Lee
Also filed as: LEE Y J
3 granted patents·3 pending applications·39 citations·filing 2001–2003
65Inventor score
Top patents by PatentIndex Score
6 records- 0179US6686615B1Flip-chip type semiconductor device for reducing signal skewCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Feb 3, 2004·35 cites·5 claims
- 0248US6605480B2Wafer level packaging for making flip-chipsCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Aug 12, 2003·4 cites·8 claims
- 0342US7005054B2Method for manufacturing probes of a probe cardCHIPMOS TECHNOLOGIES INC·Filed 2002·Granted Feb 28, 2006·0 cites·6 claims
- 0433US2005070049A1Method for fabricating wafer-level chip scale packagesFiled 2003·Application pending·0 cites
- 0532US2004012405A1Probe card with full wafer contact configurationCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Application pending·0 cites
- 0628US2005014308A1Manufacturing process of memory module with direct die-attachmentFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →