Inventor · disambiguated record
Yasuhiko Akaike
Also filed as: AKAIKE YASUHIKO
26 granted patents·13 pending applications·460 citations·filing 1999–2021
96Inventor score
Top patents by PatentIndex Score
39 records- 0196US6465809B1Bonding type semiconductor substrate, semiconductor light emitting element, and preparation process thereofTOSHIBA KK·Filed 2000·Granted Oct 15, 2002·99 cites·16 claims
- 0294US7037738B2Method of manufacturing a semiconductor light-emitting elementTOSHIBA KK·Filed 2003·Granted May 2, 2006·147 cites·12 claims
- 0393US6815312B2Bonding type semiconductor substrate, semiconductor light emitting element, and preparation process thereofTOKYO SHIBAURA ELECTRIC CO·Filed 2002·Granted Nov 9, 2004·52 cites·3 claims
- 0492US7364982B2Process for preparing a bonding type semiconductor substrateTOSHIBA KK·Filed 2007·Granted Apr 29, 2008·14 cites·13 claims
- 0591US7462869B2Semiconductor light emitting device and semiconductor light emitting apparatusTOSHIBA KK·Filed 2007·Granted Dec 9, 2008·19 cites·7 claims
- 0690US7667224B2Semiconductor light emitting device and semiconductor light emitting apparatusTOSHIBA KK·Filed 2007·Granted Feb 23, 2010·22 cites·9 claims
- 0782US6528823B2Semiconductor light-emitting element and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted Mar 4, 2003·39 cites·11 claims
- 0876US8969157B2Method of manufacturing semiconductor device having field plate electrodeTOSHIBA KK·Filed 2013·Granted Mar 3, 2015·4 cites·12 claims
- 0976US8357557B2Semiconductor light-emitting device and process for production thereofTOSHIBA KK·Filed 2010·Granted Jan 22, 2013·2 cites·14 claims
- 1074US9147798B2Semiconductor light emitting element and method for manufacturing sameAKAIKE YASUHIKO·Filed 2012·Granted Sep 29, 2015·2 cites·10 claims
- 1173US8110451B2Method for manufacturing light emitting deviceAKAIKE YASUHIKO·Filed 2009·Granted Feb 7, 2012·5 cites·19 claims
- 1273US7038245B2Semiconductor light emitting device having angled side surfaceTOSHIBA KK·Filed 2003·Granted May 2, 2006·16 cites·4 claims
- 1369US7217635B2Process for preparing a bonding type semiconductor substrateTOSHIBA KK·Filed 2004·Granted May 15, 2007·7 cites·2 claims
- 1465US6924513B2Light emitting element and manufacturing method for the sameTOSHIBA KK·Filed 2003·Granted Aug 2, 2005·19 cites·10 claims
- 1558US8659040B2Semiconductor light-emitting device and process for production thereofFUJIMOTO AKIRA·Filed 2012·Granted Feb 25, 2014·0 cites·11 claims
- 1657US8803179B2Semiconductor light emitting deviceTOSHIBA KK·Filed 2013·Granted Aug 12, 2014·0 cites·20 claims
- 1757US2008308827A1Process for preparing a bonding type semiconductor substrateTOSHIBA KK·Filed 2008·Application pending·0 cites
- 1856US11024599B2Semiconductor device and method of manufacturing thereofRENESAS ELECTRONICS CORP·Filed 2019·Granted Jun 1, 2021·0 cites·18 claims
- 1955US8829488B2Process for preparing a bonding type semiconductor substrateFURUKAWA KAZUYOSHI·Filed 2012·Granted Sep 9, 2014·0 cites·7 claims
- 2054US2015249180A1Semiconductor light emitting element and method for manufacturing sameTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2153US9853023B2Semiconductor device and semiconductor packageTOSHIBA KK·Filed 2017·Granted Dec 26, 2017·0 cites·12 claims
- 2252US11705344B2Method of manufacturing a resin-sealed semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2021·Granted Jul 18, 2023·0 cites·10 claims
- 2351US11031254B2Method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 2451US9570439B2Semiconductor device and semiconductor packageTOSHIBA KK·Filed 2015·Granted Feb 14, 2017·0 cites·13 claims
- 2551US2012104446A1Method for manufacturing light emitting deviceAKAIKE YASUHIKO·Filed 2012·Application pending·0 cites
- 2649US7329903B2Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrateTOSHIBA KK·Filed 2006·Granted Feb 12, 2008·0 cites·21 claims
- 2748US2006151798A1Semiconductor light emitting element and semiconductor light emitting deviceTOSHIBA KK·Filed 2006·Application pending·0 cites
- 2847US6373069B1Method for evaluating an epitaxial wafer for a light emitting device, recording medium readable by a computer and epitaxial wafer for a light emitting deviceTOSHIBA KK·Filed 1999·Granted Apr 16, 2002·13 cites·10 claims
- 2947US2005253157A1Semiconductor light emitting device and semiconductor light emitting apparatusTOSHIBA KK·Filed 2005·Application pending·0 cites
- 3046US2005145864A1Semiconductor light-emitting element and method of manufacturing the sameFiled 2005·Application pending·0 cites
- 3145US8816378B2Light emitting element and method for manufacturing sameTOSHIBA KK·Filed 2013·Granted Aug 26, 2014·0 cites·18 claims
- 3245US2015262813A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3344US9318664B2Semiconductor light emitting element and method for manufacturing sameNUNOTANI SHINJI·Filed 2012·Granted Apr 19, 2016·0 cites·14 claims
- 3444US2006202219A1Semiconductor light emitting device and semiconductor light emitting apparatusTOSHIBA KK·Filed 2005·Application pending·0 cites
- 3540US2011042680A1Light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3638US2011229997A1Method for manufacturing semiconductor light emitting deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3736US2017077218A1Semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 3836US2012070958A1Method of manufacturing semiconductor deviceFURUKAWA KAZUYOSHI·Filed 2011·Application pending·0 cites
- 3933US2016049484A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →