Inventor · disambiguated record
Yasuyoshi Horikawa
Also filed as: HORIKAWA YASUYOSHI
29 granted patents·8 pending applications·275 citations·filing 2001–2018
96Inventor score
Top patents by PatentIndex Score
37 records- 0195US8419442B2Socket and method of fabricating the sameHORIKAWA YASUYOSHI·Filed 2011·Granted Apr 16, 2013·42 cites·11 claims
- 0294US7319049B2Method of manufacturing an electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2005·Granted Jan 15, 2008·40 cites·19 claims
- 0390US9159648B2Wiring substrate and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2013·Granted Oct 13, 2015·11 cites·16 claims
- 0490US7223652B2Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted May 29, 2007·19 cites·3 claims
- 0589US6897544B2Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2003·Granted May 24, 2005·38 cites·4 claims
- 0686US7414309B2Encapsulated electronic part packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 19, 2008·12 cites·6 claims
- 0786US6998308B2Substrate for carrying a semiconductor chip and a manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2003·Granted Feb 14, 2006·32 cites·15 claims
- 0880US6783652B2Process for manufacturing a wiring boardSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 31, 2004·28 cites·14 claims
- 0978US7229856B2Method of manufacturing electronic part packaging structureSHINKO ELECTRIC IND CO·Filed 2005·Granted Jun 12, 2007·7 cites·9 claims
- 1075US8708711B2Connecting terminal structure, socket and electronic packageHORIKAWA YASUYOSHI·Filed 2012·Granted Apr 29, 2014·9 cites·8 claims
- 1172US7358591B2Capacitor device and semiconductor device having the same, and capacitor device manufacturing methodSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 15, 2008·5 cites·9 claims
- 1271US7358114B2Semiconductor device substrate, semiconductor device, and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 15, 2008·4 cites·9 claims
- 1370US9324929B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Apr 26, 2016·2 cites·9 claims
- 1469US10115878B2Optical sensorSHINKO ELECTRIC IND CO·Filed 2017·Granted Oct 30, 2018·1 cites·7 claims
- 1569US9006894B2Wiring board and light emitting deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 14, 2015·2 cites·8 claims
- 1668US9084372B2Wiring substrate, light emitting device, and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 14, 2015·2 cites·12 claims
- 1764US7072168B2Capacitor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Jul 4, 2006·10 cites·14 claims
- 1862US9590154B2Wiring substrate and light emitting deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Mar 7, 2017·1 cites·11 claims
- 1962US7276438B2Method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 2, 2007·2 cites·10 claims
- 2061US8770987B2Connecting terminal structure, manufacturing method of the same and socketHORIKAWA YASUYOSHI·Filed 2011·Granted Jul 8, 2014·4 cites·8 claims
- 2156US10062490B2Method of manufacturing an inductorSHINKO ELECTRIC IND CO·Filed 2016·Granted Aug 28, 2018·0 cites·4 claims
- 2254US11437174B2Inductor and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2018·Granted Sep 6, 2022·0 cites·14 claims
- 2350US7402900B2Semiconductor device substrate, semiconductor device, and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2004·Granted Jul 22, 2008·3 cites·4 claims
- 2448US2005185382A1Substrate for carrying a semiconductor chip and a manufacturing method thereofFiled 2005·Application pending·0 cites
- 2547US2007119616A1Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 2646US9282629B2Wiring substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2014·Granted Mar 8, 2016·0 cites·9 claims
- 2746US7038904B2Capacitor and method of producing sameSHINKO ELECTRIC IND CO·Filed 2004·Granted May 2, 2006·1 cites·15 claims
- 2845US9721884B2Inductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2016·Granted Aug 1, 2017·0 cites·8 claims
- 2943US2007040238A1Coil structure, method for manufacturing the same and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 3043US2005258509A1Substrate, semiconductor device, and substrate fabricating methodHORIKAWA YASUYOSHI·Filed 2005·Application pending·0 cites
- 3142US9603253B2Wiring substrate, manufacturing method therefor, and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2015·Granted Mar 21, 2017·0 cites·14 claims
- 3242US2003173676A1Multi-layered semiconductor device and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2003·Application pending·0 cites
- 3342US2004090758A1Multi-layered semiconductor device and method of manufacturing sameFiled 2003·Application pending·0 cites
- 3441US2004265482A1Wiring substrate manufacturing methodSHINKO ELECTRIC IND CO·Filed 2004·Application pending·0 cites
- 3540US10395810B2InductorSHINKO ELECTRIC IND CO·Filed 2015·Granted Aug 27, 2019·0 cites·21 claims
- 3640US2006017133A1Electronic part-containing elements, electronic devices and production methodsSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
- 3739US11309224B2Folded substrate for stacked integrated circuit devicesSHINKO ELECTRIC IND CO·Filed 2018·Granted Apr 19, 2022·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →