Inventor · disambiguated record
Yaohuang Huang
Also filed as: HUANG YAOHUANG
7 granted patents·2 pending applications·81 citations·filing 2010–2012
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0194US8779601B2Embedded wafer level package for 3D and package-on-package applications, and method of manufactureGAN KAH WEE·Filed 2011·Granted Jul 15, 2014·34 cites·10 claims
- 0293US8916481B2Embedded wafer level package for 3D and package-on-package applications, and method of manufactureGAN KAH WEE·Filed 2011·Granted Dec 23, 2014·33 cites·25 claims
- 0382US8617987B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2010·Granted Dec 31, 2013·7 cites·9 claims
- 0470US8766422B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2011·Granted Jul 1, 2014·3 cites·3 claims
- 0560US9171823B2Circuit module with multiple submodulesGAN KAHWEE·Filed 2011·Granted Oct 27, 2015·3 cites·19 claims
- 0660US8860228B2Electronic device including electrically conductive vias having different cross-sectional areas and related methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Oct 14, 2014·1 cites·24 claims
- 0735US2012282767A1Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor packageJIN YONGGANG·Filed 2011·Application pending·0 cites
- 0834US8822267B2System in package manufacturing method using wafer-to-wafer bondingST MICROELECTRONICS PTE LTD·Filed 2012·Granted Sep 2, 2014·0 cites·20 claims
- 0931US2012161319A1Ball grid array method and structureHUANG YAOHUANG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →