Inventor · disambiguated record
Yasunobu Koshi
Also filed as: KOSHI YASUNOBU
9 granted patents·7 pending applications·297 citations·filing 2007–2025
84Inventor score
Technology areasH10P
Top patents by PatentIndex Score
16 records- 0196US9970112B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted May 15, 2018·279 cites·10 claims
- 0286US8999858B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Apr 7, 2015·7 cites·16 claims
- 0384US8304328B2Manufacturing method of semiconductor device and substrate processing apparatusMAEDA TAKAHIRO·Filed 2007·Granted Nov 6, 2012·10 cites·26 claims
- 0473US12467689B2Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0572US2025226207A1Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0671US12195848B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 14, 2025·0 cites·22 claims
- 0770US12288683B2Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 29, 2025·0 cites·14 claims
- 0865US12435439B2Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0964US9666430B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 30, 2017·1 cites·13 claims
- 1061US2025105007A1Substrate processing method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1158US11618947B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 4, 2023·0 cites·19 claims
- 1258US2024003005A1Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1357US2023402281A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1456US2024105465A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1549US2013068159A1Manufacturing Method of Semiconductor Device and Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 1648US2013149846A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →