Inventor · disambiguated record
Yangyang Sun
Also filed as: SUN YANGYANG
31 granted patents·47 pending applications·26 citations·filing 2011–2025
93Inventor score
Files withQUALCOMM INC46APPLIED MATERIALS INC21CONTEMPORARY AMPEREX TECHNOLOGY CO LTD2GANDHI JASPREET S2SUN YANGYANG2
Top patents by PatentIndex Score
78 records- 0193US12019242B2Full-field metrology tool for waveguide combiners and meta-surfacesAPPLIED MATERIALS INC·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 0285US11948909B2Package comprising spacers between integrated devicesQUALCOMM INC·Filed 2022·Granted Apr 2, 2024·1 cites·26 claims
- 0385US8569167B2Methods for forming a semiconductor structureGANDHI JASPREET S·Filed 2011·Granted Oct 29, 2013·7 cites·18 claims
- 0484US12203747B2Interference in-sensitive Littrow system for optical device structure measurementAPPLIED MATERIALS INC·Filed 2024·Granted Jan 21, 2025·0 cites·20 claims
- 0584US9362143B2Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packagesSUN YANGYANG·Filed 2012·Granted Jun 7, 2016·12 cites·26 claims
- 0684US2025377484A1Stacked metalens surfaces for 3d sensorsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0781US11557557B2Flip-chip flexible under bump metallization sizeQUALCOMM INC·Filed 2020·Granted Jan 17, 2023·1 cites·24 claims
- 0879US2025054171A1Optical resolution measurement method for optical devicesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0976US11321837B2Fiber imaging apparatus, methods, and applicationsUNIV CENTRAL FLORIDA RES FOUND INC·Filed 2020·Granted May 3, 2022·1 cites·10 claims
- 1076US2024310639A1Full-field metrology tool for waveguide combiners and meta-surfacesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1174US11913776B2Interference in-sensitive Littrow system for optical device structure measurementAPPLIED MATERIALS INC·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 1273US11978196B2See-through metrology systems, apparatus, and methods for optical devicesAPPLIED MATERIALS INC·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 1373US11748875B2See-through metrology systems, apparatus, and methods for optical devicesAPPLIED MATERIALS INC·Filed 2021·Granted Sep 5, 2023·0 cites·17 claims
- 1468US12379280B2Method of measuring efficiency for optical devicesAPPLIED MATERIALS INC·Filed 2022·Granted Aug 5, 2025·0 cites·7 claims
- 1568US2025053099A1Asymmetric metrology tool for reflective waveguideAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1668US2024274960A1Packaging box, battery, and electrical deviceCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 1768US2024213612A1Battery module end plate, battery module, and preparation method for battery module end plateCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 1867US12165341B2Optical resolution measurement method for optical devicesAPPLIED MATERIALS INC·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 1967US11988574B2Illumination system for AR metrology toolAPPLIED MATERIALS INC·Filed 2021·Granted May 21, 2024·0 cites·9 claims
- 2067US2024385075A1Illumination system for ar metrology toolAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2167US2022308263A1STACKED METALENS SURFACES FOR 3D SENSORsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2267US2025068087A1Mirror folded illumination for compact optical metrology systemAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2366US12236575B2In-line metrology systems, apparatus, and methods for optical devicesAPPLIED MATERIALS INC·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 2466US12229940B2In-line metrology systems, apparatus, and methods for optical devicesAPPLIED MATERIALS INC·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 2565US2024329322A1Low refractive index materials on the gratings to improve the waveguide efficiencyAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2663US8872356B2Semiconductor structures comprising a dielectric material having a curvilinear profileMICRON TECHNOLOGY INC·Filed 2013·Granted Oct 28, 2014·1 cites·18 claims
- 2762US12398998B2Methods for high-resolution, stable measurement of pitch and orientation in optical gratingsAPPLIED MATERIALS INC·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 2862US2023251161A1High-precision and high-throughput measurement of percentage light loss of optical devicesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2960US2025273626A1Package comprising integrated devices and an interconnection deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3060US2025273627A1Package comprising a base substrate and integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3160US2025300104A1Integrated device comprising metallization portion with step pad interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3260US2025246582A1Stacked integrated circuit devices including logic die and memory stacksQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3360US2025309078A1Semiconductor die having a die interconnect and a die level distribution (dld) metallization layer including a metal line and a metal pad having a width greater than the width of the metal line for improved signal path conductivity between the die interconnect and the metal padQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3460US2024355781A1Integrated device comprising an offset interconnectQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3560US2025279381A1Semiconductor die having a die level distribution (dld) metallization structure including a metal pad and a shorter via coupling the metal pad to a metal interconnect in the die for improved signal path conductivityQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3659US2025246569A1Stacked integrated circuit devices with face-to-face connections between logic and memory diesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3759US2025273586A1Package comprising a base portion and integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3859US2025246531A1Integrated circuit (ic) package with die interconnects terminating at multiple metallization layers in a substrate to reduce spacing requirements between die interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3959US2025300102A1Integrated device comprising metallization portionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4058US12500188B2Flip-chip bumping metal layer and bump structureQUALCOMM INC·Filed 2023·Granted Dec 16, 2025·0 cites·27 claims
- 4158US12463127B2Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methodsQUALCOMM INC·Filed 2023·Granted Nov 4, 2025·0 cites·21 claims
- 4258US12386155B2Ultra-wide angle lens systems with external pupilAPPLIED MATERIALS INC·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 4358US2025300080A1INTEGRATED CIRCUITS (ICs) HAVING SEPARATE SIGNAL AND POWER DISTRIBUTION NETWORK (PDN) INTERCONNECT STRUCTURES FOR REDUCED POWER SIGNAL ROUTING CONGESTION AND PATH LENGTHS, AND RELATED THREE-DIMENSIONAL (3D) ICs (3DICs) AND FABRICATION METHODSQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4458US2025273548A1Package comprising a bridge with spring padsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4557US2025357288A1Package comprising a substrate, an integrated device and an interconnect over the integrated deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4657US2025062285A1Stacked integrated circuit devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4757US2024421119A1Flexible under-bump metallization (ubm) sizes and patterning, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4857US2025183211A1Stress mitigating pillar bumpsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4956US12500187B2Package comprising an interconnection die located between substratesQUALCOMM INC·Filed 2022·Granted Dec 16, 2025·0 cites·25 claims
- 5056US11417622B2Flip-chip deviceQUALCOMM INC·Filed 2020·Granted Aug 16, 2022·0 cites·30 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Yangyang Sun files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →