Inventor · disambiguated record
Yasuo Takemoto
Also filed as: TAKEMOTO YASUO
9 granted patents·10 pending applications·49 citations·filing 2005–2024
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
19 records- 0191US7339257B2Semiconductor device in which semiconductor chip is mounted on lead frameTOSHIBA KK·Filed 2005·Granted Mar 4, 2008·35 cites·18 claims
- 0281US7608787B2Semiconductor memory device and USB memory device using the sameTOSHIBA KK·Filed 2006·Granted Oct 27, 2009·11 cites·21 claims
- 0367USRE49332EStorage medium and semiconductor packageKIOXIA CORP·Filed 2020·Granted Dec 13, 2022·0 cites·36 claims
- 0465US8115290B2Storage medium and semiconductor packageYAMAMOTO TETSUYA·Filed 2009·Granted Feb 14, 2012·2 cites·15 claims
- 0562US2025210592A1Semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 0657US2024178192A1Semiconductor deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 0755USRE48110EStorage medium and semiconductor packageTOSHIBA MEMORY CORP·Filed 2014·Granted Jul 21, 2020·0 cites·85 claims
- 0855US7968997B2Semiconductor deviceTOSHIBA KK·Filed 2009·Granted Jun 28, 2011·1 cites·17 claims
- 0954US12419047B2Semiconductor device and semiconductor device manufacturing methodKIOXIA CORP·Filed 2022·Granted Sep 16, 2025·0 cites·13 claims
- 1054US2023178491A1Semiconductor deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1145US8022515B2Semiconductor deviceTOSHIBA KK·Filed 2008·Granted Sep 20, 2011·0 cites·20 claims
- 1244US10916508B2Semiconductor device package with radiation shieldTOSHIBA MEMORY CORP·Filed 2018·Granted Feb 9, 2021·0 cites·13 claims
- 1341US2020303299A1Semiconductor Device and Method of Manufacturing Semiconductor DeviceTOSHIBA MEMORY CORP·Filed 2019·Application pending·0 cites
- 1440US2006261489A1Semiconductor memory card and method of fabricating the sameTAKEMOTO YASUO·Filed 2006·Application pending·0 cites
- 1539US2007045873A1Semiconductor memory card and method for manufacturing semiconductor memory cardTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1637US2012248628A1Semiconductor device and method of fabricating the sameTANAKA JUN·Filed 2011·Application pending·0 cites
- 1737US2019287939A1Semiconductor device and fabricating method of the sameTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 1835US2010181661A1Semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 1931US2013062758A1Semiconductor deviceIMOTO TAKASHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →