Inventor · disambiguated record
Yan Wang
Also filed as: WANG YAN · WANG YAN MEI
30 granted patents·22 pending applications·581 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
52 records- 0198US11119146B1Testing of bonded wafers and structures for testing bonded wafersXILINX INC·Filed 2020·Granted Sep 14, 2021·13 cites·20 claims
- 0298US6776693B2Method and apparatus for face-up substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·101 cites·46 claims
- 0396US11650249B1Wafer testing and structures for wafer testingXILINX INC·Filed 2020·Granted May 16, 2023·4 cites·20 claims
- 0496US6899804B2Electrolyte composition and treatment for electrolytic chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·77 cites·37 claims
- 0593US6979248B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 27, 2005·42 cites·61 claims
- 0691US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 0791US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 0890US6988942B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 24, 2006·41 cites·18 claims
- 0988US7207878B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·11 cites·19 claims
- 1086US7276743B2Retaining ring with conductive portionAPPLIED MATERIALS INC·Filed 2005·Granted Oct 2, 2007·11 cites·28 claims
- 1186US7229535B2Hydrogen bubble reduction on the cathode using double-cell designsAPPLIED MATERIALS INC·Filed 2003·Granted Jun 12, 2007·25 cites·20 claims
- 1286US7066800B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jun 27, 2006·31 cites·67 claims
- 1386US6837983B2Endpoint detection for electro chemical mechanical polishing and electropolishing processesAPPLIED MATERIALS INC·Filed 2002·Granted Jan 4, 2005·32 cites·39 claims
- 1484US7790015B2Endpoint for electroprocessingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·8 cites·15 claims
- 1584US7655565B2Electroprocessing profile controlAPPLIED MATERIALS INC·Filed 2005·Granted Feb 2, 2010·8 cites·32 claims
- 1683US8066552B2Multi-layer polishing pad for low-pressure polishingDUBOUST ALAIN·Filed 2005·Granted Nov 29, 2011·10 cites·31 claims
- 1782US7210988B2Method and apparatus for reduced wear polishing pad conditioningAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·9 cites·35 claims
- 1882US7137879B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·7 cites·20 claims
- 1981US7160432B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jan 9, 2007·21 cites·34 claims
- 2079US7344431B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·5 cites·21 claims
- 2178US11508667B1Embedded shield for protection of memory cellsXILINX INC·Filed 2019·Granted Nov 22, 2022·2 cites·18 claims
- 2278US7128825B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·20 cites·29 claims
- 2378US7077721B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2003·Granted Jul 18, 2006·17 cites·31 claims
- 2473US7232514B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jun 19, 2007·15 cites·63 claims
- 2568US7709382B2Electroprocessing profile controlAPPLIED MATERIALS INC·Filed 2007·Granted May 4, 2010·2 cites·11 claims
- 2668US2024411192A1Layered Substrate with Reduced Blue Dot Defect DensitySAGE ELECTROCHROMICS INC·Filed 2024·Application pending·0 cites
- 2766US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 2860US7311592B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Dec 25, 2007·1 cites·17 claims
- 2957US12498340B2Resistivity control of coated glass units for uniformity improvementSAGE ELECTROCHROMICS INC·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 3055US2008038999A1Retaining ring with conductive portionAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 3153US2023317529A1Method of testing structures and stacking wafersXILINX INC·Filed 2022·Application pending·0 cites
- 3252US2007215488A1Methods and apparatus for electroprocessing with recessed bias contactAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3351US2008108288A1Conductive Polishing Article for Electrochemical Mechanical PolishingHU YONGQI·Filed 2007·Application pending·0 cites
- 3451US2011132884A1Laser modules and processes for thin film solar panel laser scribingAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 3551US2006124474A1Method and apparatus for local polishing controlAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3649US2010267318A1Polishing pad with projecting portionDUBOUST ALAIN·Filed 2010·Application pending·0 cites
- 3749US2011053465A1Method and apparatus for local polishing controlTSAI STAN·Filed 2010·Application pending·0 cites
- 3848US2010096360A1Compositions and methods for barrier layer polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3948US2007295611A1Method and composition for polishing a substrateLIU FENG Q·Filed 2007·Application pending·0 cites
- 4045US2004072445A1Effective method to improve surface finish in electrochemically assisted CMPAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4144US2005061674A1Endpoint compensation in electroprocessingFiled 2004·Application pending·0 cites
- 4244US2009061741A1Ecmp polishing sequence to improve planarity and defect performanceWANG ZHIHONG·Filed 2007·Application pending·0 cites
- 4343US7842169B2Method and apparatus for local polishing controlAPPLIED MATERIALS INC·Filed 2003·Granted Nov 30, 2010·0 cites·32 claims
- 4443US7678245B2Method and apparatus for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2004·Granted Mar 16, 2010·0 cites·26 claims
- 4543US2003190278A1Controlled deposition of nanotubesFiled 2003·Application pending·0 cites
- 4643US2007243709A1Planarization of substrates at a high polishing rate using electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4742US2007096315A1Ball contact cover for copper loss reduction and spike reductionAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4841US2004020789A1Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4939US2008277787A1Method and pad design for the removal of barrier material by electrochemical mechanical processingLIU FENG Q·Filed 2007·Application pending·0 cites
- 5038US2008003931A1System and method for in-situ head rinseMANENS ANTOINE P·Filed 2006·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →