Inventor · disambiguated record
Yayi Wei
Also filed as: WEI YAYI
13 granted patents·11 pending applications·135 citations·filing 2001–2023
90Inventor score
Files withINST OF MICROELECTRONICS CAS8INFINEON TECHNOLOGIES AG7WEI YAYI5GLOBALFOUNDRIES INC2GLOBAL FOUNDRIES INC1
Top patents by PatentIndex Score
24 records- 0195US6755956B2Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowiresUT BATTELLE LLC·Filed 2001·Granted Jun 29, 2004·85 cites·8 claims
- 0291US7662436B1Method of spin coating a film of non-uniform thicknessINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 16, 2010·15 cites·19 claims
- 0382US7071074B2Structure and method for placement, sizing and shaping of dummy structuresINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 4, 2006·19 cites·20 claims
- 0481US7199062B2Method for forming a resist film on a substrate having non-uniform topographyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 3, 2007·9 cites·27 claims
- 0575US7868427B2Structure and method for placement, sizing and shaping of dummy structuresINFINEON TECHNOLOGIES AG·Filed 2009·Granted Jan 11, 2011·3 cites·21 claims
- 0674US8912489B2Defect removal processGLOBALFOUNDRIES INC·Filed 2013·Granted Dec 16, 2014·2 cites·17 claims
- 0770US7494930B2Structure and method for placement, sizing and shaping of dummy structuresINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 24, 2009·2 cites·6 claims
- 0858US12222641B2Method and device for optimizing mask parametersINST OF MICROELECTRONICS CAS·Filed 2021·Granted Feb 11, 2025·0 cites·8 claims
- 0956US8921166B2Structure and method for placement, sizing and shaping of dummy structuresINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 30, 2014·0 cites·21 claims
- 1055US12237213B2Method for manufacturing semiconductor deviceINST OF MICROELECTRONICS CAS·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 1155US2025383607A1Method and apparatus for training on imaging of plasma lithographyINST OF MICROELECTRONICS CAS·Filed 2023·Application pending·0 cites
- 1252US12198930B2Method for manufacturing semiconductor deviceINST OF MICROELECTRONICS CAS·Filed 2021·Granted Jan 14, 2025·0 cites·10 claims
- 1351US2011133304A1Structure and Method for Placement, Sizing and Shaping of Dummy StructuresINFINEON TECHNOLOGIES AG·Filed 2010·Application pending·0 cites
- 1450US8507186B2Patterning methods and masksWEI YAYI·Filed 2012·Granted Aug 13, 2013·0 cites·20 claims
- 1550US2025355145A1Method for optimizing mask absorption material based on surface plasmon multilayer structure, and plasmonic superlensINST OF MICROELECTRONICS CAS·Filed 2023·Application pending·0 cites
- 1645US8227174B2Patterning methods and masksWEI YAYI·Filed 2010·Granted Jul 24, 2012·0 cites·20 claims
- 1745US2025224684A1Analytic method and device for quantitatively calculating line edge roughness in plasma ultra-diffraction photoetching processINST OF MICROELECTRONICS CAS·Filed 2021·Application pending·0 cites
- 1845US2024077799A1Method for correcting lithography pattern of surface plasmaINST OF MICROELECTRONICS CAS·Filed 2021·Application pending·0 cites
- 1944US2007166650A1Patterning methods and masksWEI YAYI·Filed 2006·Application pending·0 cites
- 2044US2024005064A1Method and apparatus for optimizing lithography quality, electronic device, medium and program productINST OF MICROELECTRONICS CAS·Filed 2021·Application pending·0 cites
- 2138US2014211175A1Enhancing resolution in lithographic processes using high refractive index fluidsGLOBAL FOUNDRIES INC·Filed 2013·Application pending·0 cites
- 2236US2014113420A1Methods of avoiding shadowing when forming source/drain implant regions on 3d semiconductor devicesGLOBALFOUNDRIES INC·Filed 2012·Application pending·0 cites
- 2336US2008070126A1Patterning masks, methods, and systemsWEI YAYI·Filed 2006·Application pending·0 cites
- 2434US2007166640A1Defect reduction in immersion lithographyWEI YAYI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →