Inventor · disambiguated record
Yan Zhao
Also filed as: ZHAO YAN · ZHAO YAN YANG
15 granted patents·3 pending applications·223 citations·filing 1992–2022
91Inventor score
Files withFINISAR CORP4APPLIED MATERIALS INC3HERMES MICROVISION INC3CADENCE DESIGN SYSTEMS INC1CHINA PETROCHEMICAL CORP1
Top patents by PatentIndex Score
18 records- 0195US7105436B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION INC·Filed 2004·Granted Sep 12, 2006·84 cites·12 claims
- 0294US6815345B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION TAIWAN INC·Filed 2002·Granted Nov 9, 2004·101 cites·5 claims
- 0381US9330987B2Hot spot identification, inspection, and reviewHERMES MICROVISION INC·Filed 2014·Granted May 3, 2016·5 cites·25 claims
- 0474US11980992B2Integrated abrasive polishing pads and manufacturing methodsAPPLIED MATERIALS INC·Filed 2022·Granted May 14, 2024·0 cites·19 claims
- 0574US11471999B2Integrated abrasive polishing pads and manufacturing methodsAPPLIED MATERIALS INC·Filed 2018·Granted Oct 18, 2022·1 cites·14 claims
- 0673US7474001B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION INC·Filed 2006·Granted Jan 6, 2009·4 cites·5 claims
- 0771US9538637B2Multichannel RF feedthroughsZHAO YAN YANG·Filed 2012·Granted Jan 3, 2017·3 cites·13 claims
- 0870US10845553B2Multichannel RF feedthroughsII VI DELAWARE INC·Filed 2016·Granted Nov 24, 2020·1 cites·13 claims
- 0970US7978030B2High-speed interconnectsFINISAR CORP·Filed 2008·Granted Jul 12, 2011·4 cites·9 claims
- 1055US5286692AMild hydrocracking catlyst and the process thereforCHINA PETROCHEMICAL CORP·Filed 1992·Granted Feb 15, 1994·20 cites·24 claims
- 1155US2023412553A1Joining community subgroup with verificationSNAP INC·Filed 2022·Application pending·0 cites
- 1252US7859367B2Non-coplanar high-speed interconnectsFINISAR CORP·Filed 2008·Granted Dec 28, 2010·0 cites·20 claims
- 1346US2015167173A1Printing method for printing and plating processLEE SANG-IL·Filed 2012·Application pending·0 cites
- 1445US10140410B1Representing a routing strip in an integrated circuit design using a digit patternCADENCE DESIGN SYSTEMS INC·Filed 2016·Granted Nov 27, 2018·0 cites·16 claims
- 1543US9900974B2Flex-less multilayer ceramic substrateFINISAR CORP·Filed 2016·Granted Feb 20, 2018·0 cites·17 claims
- 1643US7880570B2Feed thru with flipped signal plane using guided viasFINISAR CORP·Filed 2008·Granted Feb 1, 2011·0 cites·11 claims
- 1742US12243840B2Wirebondable interposer for flip chip packaged integrated circuit dieSAMTEC INC·Filed 2020·Granted Mar 4, 2025·0 cites·23 claims
- 1841US2019139788A1Apparatus and methods for packaging semiconductor diesAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →