Inventor · disambiguated record
Yee Heong Chua
Also filed as: CHUA YEE HEONG
4 granted patents·176 citations·filing 2003–2005
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0194US7327017B2Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compoundUTAC THAI LTD·Filed 2005·Granted Feb 5, 2008·40 cites·22 claims
- 0291US7205180B1Process of fabricating semiconductor packages using leadframes roughened with chemical etchantNS ELECTRONICS BANGKOK 1993 LT·Filed 2004·Granted Apr 17, 2007·60 cites·76 claims
- 0386US7049683B1Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compoundNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted May 23, 2006·40 cites·30 claims
- 0480US7153724B1Method of fabricating no-lead package for semiconductor die with half-etched leadframeNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted Dec 26, 2006·36 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →