Inventor · disambiguated record

Yeong-Jyh Lin

Also filed as: LIN YEONG-JYH

55 granted patents·10 pending applications·165 citations·filing 2006–2025

98Inventor score

Technology areasH10W H10P B29C H01L B81C

Files withTAIWAN SEMICONDUCTOR MFG CO LTD54 CHIPMOS TECHNOLOGIES INC3 TAIWAN SEMICONDUCTOR MFG3 CHIPMOS TECHNOLOGIES BERMUDA1 HWANG CHIEN LING1

Top patents by PatentIndex Score

65 records

0198US11189515B2Method for alignment, process tool and method for wafer-level alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·5 cites·20 claims
0297US11862612B23D trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·4 cites·20 claims
0397US11211362B23D trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·6 cites·20 claims
0497US9834435B1Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·20 cites·20 claims
0597US9093337B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·27 cites·20 claims
0695US10157881B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·9 cites·20 claims
0794US11916022B2Photolithography alignment process for bonded wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·2 cites·20 claims
0891US9484226B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·5 cites·20 claims
0991US2025357123A1Apparatus and method for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1090US10510712B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·3 cites·20 claims
1190US10056285B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·4 cites·20 claims
1288US7781878B2Zigzag-stacked package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Aug 24, 2010·16 cites·10 claims
1387US11925033B2Embedded backside memory on a field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
1487US9768142B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·7 cites·20 claims
1586US10636688B2Method for alignment, process tool and method for wafer-level alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·3 cites·20 claims
1686US8951037B2Wafer-level underfill and over-moldingJANG BOR-PING·Filed 2012·Granted Feb 10, 2015·5 cites·20 claims
1785US9425179B2Chip packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·5 cites·20 claims
1885US7554197B2High frequency IC package and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jun 30, 2009·14 cites·12 claims
1984US2025273632A13d trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2083US12334475B23D trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
2183US12289979B2Deposition system for high accuracy patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
2282US12230585B2Photolithography alignment process for bonded wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 18, 2025·0 cites·20 claims
2382US9659891B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·4 cites·20 claims
2482US8540136B1Methods for stud bump formation and apparatus for performing the sameLIN YEONG-JYH·Filed 2012·Granted Sep 24, 2013·6 cites·19 claims
2581US12213323B2Embedded backside memory on a field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
2680US2024381667A1Embedded backside memory on a field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2779US12444607B2Apparatus and method for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
2879US2025230536A1Deposition system for high accuracy patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2978US9418953B2Packaging through pre-formed metal pinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 16, 2016·3 cites·20 claims
3077US12500206B2Mechanical wafer alignment detection for bonding processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
3177US11390000B2Wafer level transfer molding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
3277US9893044B2Wafer-level underfill and over-moldingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·1 cites·20 claims
3376US10147693B2Methods for stud bump formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 4, 2018·2 cites·20 claims
3474US9498851B2Methods for forming apparatus for stud bump formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·20 claims
3573US9812346B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·1 cites·20 claims
3673US9583365B2Method of forming interconnects for three dimensional integrated circuitYU CHUN HUI·Filed 2012·Granted Feb 28, 2017·4 cites·18 claims
3771US11348790B2Apparatus and method for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·0 cites·20 claims
3871US10276531B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
3971US2025157943A1Photolithography alignment process for bonded wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4070US11688717B2Mechanical wafer alignment detection for bonding processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
4170US9021682B2Apparatus for stud bump formationHWANG CHIEN LING·Filed 2012·Granted May 5, 2015·2 cites·19 claims
4269US10513070B2Wafer level transfer molding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·17 claims
4368US11818944B2Deposition system for high accuracy patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
4468US10985135B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
4566US7642639B2COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the sameCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 5, 2010·3 cites·24 claims
4663US10770331B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
4763US9802349B2Wafer level transfer molding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·0 cites·19 claims
4862US11233032B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·20 claims
4961US10804234B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·20 claims
5060US11127725B2Semiconductor structure and associated manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 21, 2021·0 cites·20 claims

Showing the top 50 of 65 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →