Inventor · disambiguated record
Yih-Yuh Doong
Also filed as: DOONG YIH Y · DOONG YIH-YUH · DOONG YIH-YUH (KELVIN)
19 granted patents·1 pending application·208 citations·filing 1997–2017
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG9PDF SOLUTIONS INC5UNITED MICROELECTRONICS CORP3DOONG YIH-YUH1TAIWAN SEMICONDUCTOR MFG CORP1
Top patents by PatentIndex Score
20 records- 0189US7783999B2Electrical parameter extraction for integrated circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 24, 2010·23 cites·16 claims
- 0288US7772868B2Accurate capacitance measurement for ultra large scale integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 10, 2010·9 cites·7 claims
- 0387US8037575B2Method for shape and timing equivalent dimension extractionTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 18, 2011·17 cites·18 claims
- 0483US6576894B1Structure for FIB based microanalysis and method for manufacturing itTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 10, 2003·24 cites·20 claims
- 0582US8115500B2Accurate capacitance measurement for ultra large scale integrated circuitsDOONG YIH-YUH·Filed 2011·Granted Feb 14, 2012·5 cites·11 claims
- 0677US6577149B2Method and device for addressable failure site test structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 10, 2003·27 cites·6 claims
- 0774US6150235AMethod of forming shallow trench isolation structuresWORLDWIDE SEMICONDUCTOR MFG·Filed 2000·Granted Nov 21, 2000·26 cites·16 claims
- 0868US7880494B2Accurate capacitance measurement for ultra large scale integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 1, 2011·1 cites·6 claims
- 0968US5926688AMethod of removing thin film layers of a semiconductor componentUNITED MICROELECTRONICS CORP·Filed 1997·Granted Jul 20, 1999·35 cites·10 claims
- 1061US7405585B2Versatile semiconductor test structure arrayTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 29, 2008·3 cites·20 claims
- 1159US5940678AMethod of forming precisely cross-sectioned electron-transparent samplesUNITED MICROELECTRONICS CORP·Filed 1997·Granted Aug 17, 1999·21 cites·32 claims
- 1254US10546792B2Method for manufacturing a semiconductor product waferPDF SOLUTIONS INC·Filed 2017·Granted Jan 28, 2020·0 cites·10 claims
- 1352US5747803AMethod for preventing charging effect and thermal damage in charged-particle microscopyUNITED MICROELECTRONICS CORP·Filed 1997·Granted May 5, 1998·10 cites·8 claims
- 1451US10096378B1On-chip capacitance measurement for memory characterization vehiclePDF SOLUTIONS INC·Filed 2017·Granted Oct 9, 2018·1 cites·22 claims
- 1549US9847264B1Method for manufacturing a semiconductor product waferPDF SOLUTIONS INC·Filed 2015·Granted Dec 19, 2017·0 cites·10 claims
- 1646US6396751B1Semiconductor device comprising a test structureTAIWAN SEMICONDUCTOR MFG CORP·Filed 2001·Granted May 28, 2002·6 cites·9 claims
- 1745US7825678B2Test pad design for reducing the effect of contact resistancesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 2, 2010·0 cites·12 claims
- 1841US10380305B1Direct probing characterization vehicle for transistor, capacitor and resistor testingPDF SOLUTIONS INC·Filed 2016·Granted Aug 13, 2019·0 cites·15 claims
- 1938US2005205961A1Model-based insertion of irregular dummy featuresTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 2029US10410735B1Direct access memory characterization vehiclePDF SOLUTIONS INC·Filed 2017·Granted Sep 10, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →